View XC236508_4990222.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

D a ta S h ee t , V 2 . 1, Au g . 2 0 0 8
XC2365
1 6 / 3 2 - B i t S i n g l e -C h i p M i c r o c o n t r o l l e r w i t h 32-Bit Performance
M i c r o c o n t r o l l e rs
Edition 2008-08 Published by Infineon Technologies AG 81726 Munchen, Germany
(c) Infineon Technologies AG 2008.
All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
D a ta S h ee t , V 2 . 1, Au g . 2 0 0 8
XC2365
1 6 / 3 2 - B i t S i n g l e -C h i p M i c r o c o n t r o l l e r w i t h 32-Bit Performance
M i c r o c o n t r o l l e rs
XC2365 XC2000 Family Derivatives
XC2365 Revision History: V2.1, 2008-08 Previous Version(s): V2.0, 2008-03, Preliminary V0.1, 2007-06, Preliminary Page several 13f 27 66 71, 73 72, 74 79 92f 105 Subjects (major changes since last revision) Maximum frequency changed to 80 MHz Missing ADC0 channels added Voltage domain for XTAL1/XTAL2 corrected to M Coupling factors corrected Improved leakage parameters Pin leakage formula corrected Improved ADC error values Improved definition of external clock parameters JTAG clock speed corrected
We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com
Data Sheet
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
1 2 2.1 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.15 3.16 4 4.1 4.2 4.2.1 4.2.2 4.2.3 4.3 4.4 4.5 4.6 4.6.1 4.6.2 4.6.3 4.6.4 4.6.5 4.6.6 5 5.1 5.2
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Bus Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capture/Compare Unit (CAPCOM2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capture/Compare Units CCU6x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universal Serial Interface Channel Modules (USIC) . . . . . . . . . . . . . . . . . MultiCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 30 33 34 36 42 43 46 48 52 54 55 57 59 59 60 62
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 DC Parameters for Upper Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . 71 DC Parameters for Lower Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . 73 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 System Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 External Clock Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Synchronous Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 102 JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Data Sheet
3
V2.1, 2008-08
16/32-Bit Single-Chip Microcontroller with 32-Bit Performance XC2000 Family
XC2365
1
Summary of Features
For a quick overview and easy reference, the features of the XC2365 are summarized here. * High-performance CPU with five-stage pipeline - 12.5 ns instruction cycle at 80 MHz CPU clock (single-cycle execution) - One-cycle 32-bit addition and subtraction with 40-bit result - One-cycle multiplication (16 x 16 bit) - Background division (32 / 16 bit) in 21 cycles - One-cycle multiply-and-accumulate (MAC) instructions - Enhanced Boolean bit manipulation facilities - Zero-cycle jump execution - Additional instructions to support HLL and operating systems - Register-based design with multiple variable register banks - Fast context switching support with two additional local register banks - 16 Mbytes total linear address space for code and data - 1024 Bytes on-chip special function register area (C166 Family compatible) Interrupt system with 16 priority levels for up to 79 sources - Selectable external inputs for interrupt generation and wake-up - Fastest sample-rate 12.5 ns Eight-channel interrupt-driven single-cycle data transfer with Peripheral Event Controller (PEC), 24-bit pointers cover total address space Clock generation from internal or external clock sources, using on-chip PLL or prescaler On-chip memory modules - 1 Kbyte on-chip stand-by RAM (SBRAM) - 2 Kbytes on-chip dual-port RAM (DPRAM) - 16 Kbytes on-chip data SRAM (DSRAM) - Up to 32 Kbytes on-chip program/data SRAM (PSRAM) - Up to 576 Kbytes on-chip program memory (Flash memory) On-Chip Peripheral Modules - Two Synchronizable A/D Converters with up to 16 channels, 10-bit resolution, conversion time below 1 s, optional data preprocessing (data reduction, range check) - 16-channel general purpose capture/compare unit (CAPCOM2) - Two capture/compare units for flexible PWM signal generation (CCU6x) - Multi-functional general purpose timer unit with 5 timers
*
* * *
*
Data Sheet
4
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Summary of Features - Six serial interface channels to be used as UART, LIN, high-speed synchronous channel (SPI/QSPI), IIC bus interface (10-bit addressing, 400 kbit/s), IIS interface - On-chip MultiCAN interface (Rev. 2.0B active) with 64 message objects (Full CAN/Basic CAN) on 3 CAN nodes and gateway functionality - On-chip real time clock Up to 12 Mbytes external address space for code and data - Programmable external bus characteristics for different address ranges - Multiplexed or demultiplexed external address/data buses - Selectable address bus width - 16-bit or 8-bit data bus width - Four programmable chip-select signals Single power supply from 3.0 V to 5.5 V Programmable watchdog timer and oscillator watchdog Up to 75 general purpose I/O lines On-chip bootstrap loaders Supported by a full range of development tools including C compilers, macroassembler packages, emulators, evaluation boards, HLL debuggers, simulators, logic analyzer disassemblers, programming boards On-chip debug support via JTAG interface 100-pin Green LQFP package, 0.5 mm (19.7 mil) pitch
*
* * * * *
* *
Ordering Information The ordering code for an Infineon microcontroller provides an exact reference to a specific product. This ordering code identifies: * * the derivative itself, i.e. its function set, the temperature range, and the supply voltage the package and the type of delivery.
For ordering codes for the XC2365 please contact your sales representative or local distributor. This document describes several derivatives of the XC2365 group. Table 1 lists these derivatives and summarizes the differences. As this document refers to all of these derivatives, some descriptions may not apply to a specific product. For simplicity the term XC2365 is used for all derivatives throughout this document.
Data Sheet
5
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Summary of Features Table 1 Derivative1) SAK-XC236572FxxL SAF-XC236572FxxL SAK-XC236556FxxL SAF-XC236556FxxL SAK-XC236548FxxL SAF-XC236548FxxL XC2365 Derivative Synopsis Temp. Range -40 C to 125 C -40 C to 85 C -40 C to 125 C -40 C to 85 C -40 C to 125 C -40 C to 85 C Program Memory2) PSRAM3) CCU6 ADC4) Interfaces4) Mod. Chan. 0, 1 0, 1 0, 1 0, 1 0, 1 0, 1 11 + 5 3 CAN Nodes, 6 Serial Chan. 11 + 5 3 CAN Nodes, 6 Serial Chan. 11 + 5 3 CAN Nodes, 6 Serial Chan. 11 + 5 3 CAN Nodes, 6 Serial Chan. 11 + 5 3 CAN Nodes, 6 Serial Chan. 11 + 5 3 CAN Nodes, 6 Serial Chan.
576 Kbytes 32 Kbytes Flash 576 Kbytes 32 Kbytes Flash 448 Kbytes 16 Kbytes Flash 448 Kbytes 16 Kbytes Flash 384 Kbytes 8 Kbytes Flash 384 Kbytes 8 Kbytes Flash
1) This Data Sheet is valid for devices starting with and including design step AC. 2) Specific inormation about the on-chip Flash memory in Table 2. 3) All derivatives additionally provide 1 Kbyte SBRAM, 2 Kbytes DPRAM, and 16 Kbytes DSRAM. 4) Specific information about the available channels in Table 3. Analog input channels are listed for each Analog/Digital Converter module separately (ADC0 + ADC1).
Data Sheet
6
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Summary of Features The XC2365 types are offered with several Flash memory sizes. Table 2 describes the location of the available memory areas for each Flash memory size. Table 2 576 Kbytes 448 Kbytes 384 Kbytes Flash Memory Allocation Flash Area A1) C0'0000H ... C0'EFFFH C0'0000H ... C0'EFFFH C0'0000H ... C0'EFFFH Flash Area B C1'0000H ... C8'FFFFH C1'0000H ... C5'FFFFH C1'0000H ... C5'FFFFH Flash Area C n.a. C8'0000H ... C8'FFFFH n.a.
Total Flash Size
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0'F000H to C0'FFFFH).
The XC2365 types are offered with different interface options. Table 3 lists the available channels for each option. Table 3 Interface Channel Association Available Channels CH0, CH2 ... CH5, CH8 ... CH11, CH13, CH15 CH0, CH2, CH4, CH5, CH6 CAN0, CAN1, CAN2 U0C0, U0C1, U1C0, U1C1, U2C0, U2C1
Total Number 11 ADC0 channels 5 ADC1 channels 3 CAN nodes 6 serial channels
Data Sheet
7
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information
2
General Device Information
The XC2365 derivatives are high-performance members of the Infineon XC2000 Family of full-feature single-chip CMOS microcontrollers. These devices extend the functionality and performance of the C166 Family in terms of instructions (MAC unit), peripherals, and speed. They combine high CPU performance (up to 80 million instructions per second) with extended peripheral functionality and enhanced IO capabilities. Optimized peripherals can be adapted flexibly to meet the application requirements. These derivatives utilize clock generation via PLL and internal or external clock sources. Onchip memory modules include program Flash, program RAM, and data RAM.
VAREFVAGND TRef VDDI VDDP VSS
(1) (1) (4) (9) (4) Port 0 8 bit Port 1 8 bit Port 2 13 bit
XTAL1 XTAL2 ESR0 ESR1
Port 10 16 bit
Port 4 4 bit Port 6 3 bit
Port 15 5 bit Port 5 11 bit
Port 7 5 bit
PORST
TRST JTAG Debug 4 bit 2 bit TESTM
via Port Pins
MC_XX_LOGSYMB100
Figure 1
Logic Symbol
Data Sheet
8
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information
2.1
Pin Configuration and Definition
The pins of the XC2365 are described in detail in Table 4, which includes all alternate functions. For further explanations please refer to the footnotes at the end of the table. Figure 2 summarizes all pins, showing their locations on the four sides of the package.
VSS VDDPB TESTM P7.2 TRST P7.0 P7.3 P7.1 P7.4 VDDIM P6.0 P6.1 P6.2 VDDPA P15.0 P15.2 P15.4 P15.5 P15.6 VAREF VAGND P5.0 P5.2 P5.3 VDDPB
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
VDDPB ESR0 ESR1 PORST XTAL1 XTAL2 P1.7 P1.6 P1.5 P10.15 P1.4 P10.14 VDDI1 P1.3 P10.13 P10.12 P1.2 P10.11 P10.10 P1.1 P10.9 P10.8 P1.0 VDDPB VS S
LQFP-100
VDDPB P0.7 P10.7 P10.6 P0.6 P10.5 P10.4 P0.5 P10.3 P2.10 TRef VDDI1 P0.4 P10.2 P0.3 P10.1 P10.0 P0.2 P2.9 P2.8 P0.1 P2.7 P0.0 VDDPB VSS
VSS VDDPB P5.4 P5.5 P5.8 P5.9 P5.10 P5.11 P5.13 P5.15 P2.12 P2.11 VDDI1 P2.0 P2.1 P2.2 P4.0 P2.3 P4.1 P2.4 P2.5 P4.2 P2.6 P4.3 VDDPB
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
MC_XX_PIN100
Figure 2
Pin Configuration (top view)
Data Sheet
9
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Notes to Pin Definitions 1. Ctrl.: The output signal for a port pin is selected by bitfield PC in the associated register Px_IOCRy. Output O0 is selected by setting the respective bitfield PC to 1x00B, output O1 is selected by 1x01B, etc. Output signal OH is controlled by hardware. 2. Type: Indicates the pad type used (St=standard pad, Sp=special pad, DP=double pad, In=input pad, PS=power supply) and its power supply domain (A, B, M, 1). Table 4 Pin 3 TESTM Pin Definitions and Functions Ctrl. I Type Function In/B Testmode Enable Enables factory test modes, must be held HIGH for normal operation (connect to VDDPB). An internal pullup device will hold this pin high when nothing is driving it. Bit 2 of Port 7, General Purpose Input/Output External Analog MUX Control Output 0 (ADC1) JTAG Test Data Input Test-System Reset Input For normal system operation, pin TRST should be held low. A high level at this pin at the rising edge of PORST activates the XC2365's debug system. In this case, pin TRST must be driven low once to reset the debug system. An internal pulldown device will hold this pin low when nothing is driving it. Bit 0 of Port 7, General Purpose Input/Output GPT1 Timer T3 Toggle Latch Output GPT2 Timer T6 Toggle Latch Output JTAG Test Data Output ESR2 Trigger Input 1 Bit 3 of Port 7, General Purpose Input/Output External Analog MUX Control Output 1 (ADC1) USIC0 Channel 1 Shift Data Output USIC0 Channel 0 Shift Data Output JTAG Test Mode Selection Input USIC0 Channel 1 Shift Data Input
10 V2.1, 2008-08
Symbol
4
P7.2 EMUX0 TDI_C
O0 / I St/B O1 I I St/B St/B In/B
5
TRST
6
P7.0 T3OUT T6OUT TDO_A ESR2_1
O0 / I St/B O1 O2 OH I O1 St/B St/B St/B St/B St/B St/B St/B St/B St/B
7
P7.3 EMUX1
O0 / I St/B
U0C1_DOUT O2 U0C0_DOUT O3 TMS_C U0C1_DX0F
Data Sheet
I I
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 8 P7.1 EXTCLK BRKIN_C 9 P7.4 EMUX2 U0C1_ SCLKOUT TCK_C U0C0_DX0D U0C1_DX1E 11 P6.0 EMUX0 BRKOUT ADCx_ REQGTyC U1C1_DX0E 12 P6.1 EMUX1 T3OUT ADCx_ REQTRyC 13 P6.2 EMUX2 T6OUT U1C1_ SCLKOUT U1C1_DX1C 15 P15.0 ADC1_CH0 Pin Definitions and Functions (cont'd) Ctrl. O1 I O1 O3 I I I O1 O3 I I O1 O2 I Type Function Bit 1 of Port 7, General Purpose Input/Output Programmable Clock Signal Output OCDS Break Signal Input Bit 4 of Port 7, General Purpose Input/Output External Analog MUX Control Output 2 (ADC1) USIC0 Channel 1 Shift Data Output USIC0 Channel 1 Shift Clock Output JTAG Clock Input USIC0 Channel 0 Shift Data Input USIC0 Channel 1 Shift Clock Input Bit 0 of Port 6, General Purpose Input/Output External Analog MUX Control Output 0 (ADC0) OCDS Break Signal Output External Request Gate Input for ADC0/1 USIC1 Channel 1 Shift Data Input Bit 1 of Port 6, General Purpose Input/Output External Analog MUX Control Output 1 (ADC0) GPT1 Timer T3 Toggle Latch Output USIC1 Channel 1 Shift Data Output External Request Trigger Input for ADC0/1 Bit 2 of Port 6, General Purpose Input/Output External Analog MUX Control Output 2 (ADC0) GPT2 Timer T6 Toggle Latch Output USIC1 Channel 1 Shift Clock Output USIC1 Channel 1 Shift Clock Input Bit 0 of Port 15, General Purpose Input Analog Input Channel 0 for ADC1 St/B St/B St/B St/B St/B St/B St/B St/B St/A St/A St/A St/A St/A St/A St/A St/A O0 / I St/B
Symbol
O0 / I St/B
U0C1_DOUT O2
O0 / I St/A
O0 / I St/A
U1C1_DOUT O3
O0 / I St/A O1 O2 O3 I I I St/A St/A St/A St/A In/A In/A
Data Sheet
11
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 16 P15.2 ADC1_CH2 T5IN 17 P15.4 ADC1_CH4 T6IN 18 P15.5 ADC1_CH5 T6EUD 19 20 21 22 23 P15.6 ADC1_CH6 Pin Definitions and Functions (cont'd) Ctrl. I I I I I I I I I I I I I I I I I I I I I I I I I I Type Function In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A Bit 2 of Port 15, General Purpose Input Analog Input Channel 2 for ADC1 GPT2 Timer T5 Count/Gate Input Bit 4 of Port 15, General Purpose Input Analog Input Channel 4 for ADC1 GPT2 Timer T6 Count/Gate Input Bit 5 of Port 15, General Purpose Input Analog Input Channel 5 for ADC1 GPT2 Timer T6 External Up/Down Control Input Bit 6 of Port 15, General Purpose Input Analog Input Channel 6 for ADC1
Symbol
VAREF VAGND
P5.0 ADC0_CH0 P5.2 ADC0_CH2 TDI_A
PS/A Reference Voltage for A/D Converters ADC0/1 PS/A Reference Ground for A/D Converters ADC0/1 In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A Bit 0 of Port 5, General Purpose Input Analog Input Channel 0 for ADC0 Bit 2 of Port 5, General Purpose Input Analog Input Channel 2 for ADC0 JTAG Test Data Input Bit 3 of Port 5, General Purpose Input Analog Input Channel 3 for ADC0 GPT1 Timer T3 Count/Gate Input Bit 4 of Port 5, General Purpose Input Analog Input Channel 4 for ADC0 GPT1 Timer T3 External Up/Down Control Input JTAG Test Mode Selection Input Bit 5 of Port 5, General Purpose Input Analog Input Channel 5 for ADC0 External Run Control Input for T12 of CCU60
24
P5.3 ADC0_CH3 T3IN
28
P5.4 ADC0_CH4 T3EUD TMS_A
29
P5.5 ADC0_CH5 CCU60_ T12HRB
Data Sheet
12
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 30 P5.8 ADC0_CH8 CCU6x_ T12HRC CCU6x_ T13HRC 31 P5.9 ADC0_CH9 CC2_T7IN 32 P5.10 ADC0_CH10 BRKIN_A 33 34 P5.11 ADC0_CH11 P5.13 ADC0_CH13 EX0BINB 35 36 P5.15 ADC0_CH15 P2.12 U0C0_ SELO4 U0C1_ SELO3 READY Pin Definitions and Functions (cont'd) Ctrl. I I I I I I I I I I I I I I I I I O1 O2 I Type Function In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A In/A St/B St/B St/B Bit 8 of Port 5, General Purpose Input Analog Input Channel 8 for ADC0 External Run Control Input for T12 of CCU6x External Run Control Input for T13 of CCU6x Bit 9 of Port 5, General Purpose Input Analog Input Channel 9 for ADC0 CAPCOM2 Timer T7 Count Input Bit 10 of Port 5, General Purpose Input Analog Input Channel 10 for ADC0 OCDS Break Signal Input Bit 11 of Port 5, General Purpose Input Analog Input Channel 11 for ADC0 Bit 13 of Port 5, General Purpose Input Analog Input Channel 13 for ADC0 External Interrupt Trigger Input Bit 15 of Port 5, General Purpose Input Analog Input Channel 15 for ADC0 Bit 12 of Port 2, General Purpose Input/Output USIC0 Channel 0 Select/Control 4 Output USIC0 Channel 1 Select/Control 3 Output External Bus Interface READY Input
Symbol
O0 / I St/B
Data Sheet
13
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 37 P2.11 U0C0_ SELO2 U0C1_ SELO2 BHE/WRH Pin Definitions and Functions (cont'd) Ctrl. O1 O2 OH Type Function Bit 11 of Port 2, General Purpose Input/Output USIC0 Channel 0 Select/Control 2 Output USIC0 Channel 1 Select/Control 2 Output External Bus Interf. High-Byte Control Output Can operate either as Byte High Enable (BHE) or as Write strobe for High Byte (WRH). Bit 0 of Port 2, General Purpose Input/Output External Bus Interface Address/Data Line 13 CAN Node 0 Receive Data Input Bit 1 of Port 2, General Purpose Input/Output CAN Node 0 Transmit Data Output External Bus Interface Address/Data Line 14 ESR1 Trigger Input 5 External Interrupt Trigger Input Bit 2 of Port 2, General Purpose Input/Output CAN Node 1 Transmit Data Output External Bus Interface Address/Data Line 15 ESR2 Trigger Input 5 External Interrupt Trigger Input Bit 0 of Port 4, General Purpose Input/Output CAPCOM2 CC24IO Capture Inp./ Compare Out. External Bus Interface Chip Select 0 Output St/B St/B St/B O0 / I St/B
Symbol
39
P2.0 AD13 RxDC0C
O0 / I St/B OH / I St/B I O1 I I O1 I I St/B St/B St/B St/B St/B St/B St/B O0 / I St/B OH / I St/B
40
P2.1 TxDC0 AD14 ESR1_5 EX0AINA
41
P2.2 TxDC1 AD15 ESR2_5 EX1AINA
O0 / I St/B OH / I St/B
42
P4.0 CC2_24 CS0
O0 / I St/B O3 / I St/B OH St/B
Data Sheet
14
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 43 P2.3 CC2_16 A16 ESR2_0 U0C0_DX0E U0C1_DX0D RxDC0A 44 P4.1 TxDC2 CC2_25 CS1 45 P2.4 TxDC0 CC2_17 A17 ESR1_0 U0C0_DX0F RxDC1A 46 P2.5 U0C0_ SCLKOUT TxDC0 CC2_18 A18 U0C0_DX1D Pin Definitions and Functions (cont'd) Ctrl. Type Function Bit 3 of Port 2, General Purpose Input/Output USIC0 Channel 0 Shift Data Output CAPCOM2 CC16IO Capture Inp./ Compare Out. External Bus Interface Address Line 16 ESR2 Trigger Input 0 USIC0 Channel 0 Shift Data Input USIC0 Channel 1 Shift Data Input CAN Node 0 Receive Data Input Bit 1 of Port 4, General Purpose Input/Output CAN Node 2 Transmit Data Output CAPCOM2 CC25IO Capture Inp./ Compare Out. External Bus Interface Chip Select 1 Output Bit 4 of Port 2, General Purpose Input/Output USIC0 Channel 1 Shift Data Output CAN Node 0 Transmit Data Output CAPCOM2 CC17IO Capture Inp./ Compare Out. External Bus Interface Address Line 17 ESR1 Trigger Input 0 USIC0 Channel 0 Shift Data Input CAN Node 1 Receive Data Input Bit 5 of Port 2, General Purpose Input/Output USIC0 Channel 0 Shift Clock Output CAN Node 0 Transmit Data Output CAPCOM2 CC18IO Capture Inp./ Compare Out. External Bus Interface Address Line 18 USIC0 Channel 0 Shift Clock Input St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B O0 / I St/B O3 / I St/B OH I I I I O2 OH
Symbol
U0C0_DOUT O1
O0 / I St/B O3 / I St/B O0 / I St/B O2 OH I I I O1 O2 OH I
U0C1_DOUT O1
O3 / I St/B
O0 / I St/B
O3 / I St/B
Data Sheet
15
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 47 P4.2 TxDC2 CC2_26 CS2 T2IN 48 P2.6 U0C0_ SELO0 U0C1_ SELO1 CC2_19 A19 U0C0_DX2D RxDC0D 49 P4.3 CC2_27 CS3 RxDC2A T2EUD 53 P0.0 CCU61_ CC60 A0 U1C0_DX0A Pin Definitions and Functions (cont'd) Ctrl. O2 OH I O1 O2 Type Function Bit 2 of Port 4, General Purpose Input/Output CAN Node 2 Transmit Data Output CAPCOM2 CC26IO Capture Inp./ Compare Out. External Bus Interface Chip Select 2 Output GPT1 Timer T2 Count/Gate Input Bit 6 of Port 2, General Purpose Input/Output USIC0 Channel 0 Select/Control 0 Output USIC0 Channel 1 Select/Control 1 Output CAPCOM2 CC19IO Capture Inp./ Compare Out. External Bus Interface Address Line 19 USIC0 Channel 0 Shift Control Input CAN Node 0 Receive Data Input Bit 3 of Port 4, General Purpose Input/Output CAPCOM2 CC27IO Capture Inp./ Compare Out. External Bus Interface Chip Select 3 Output CAN Node 2 Receive Data Input GPT1 Timer T2 External Up/Down Control Input Bit 0 of Port 0, General Purpose Input/Output USIC1 Channel 0 Shift Data Output CCU61 Channel 0 Input/Output External Bus Interface Address Line 0 USIC1 Channel 0 Shift Data Input St/B St/B St/B St/B St/B O0 / I St/B O3 / I St/B
Symbol
O0 / I St/B
O3 / I St/B OH I I St/B St/B St/B
O0 / I St/B O3 / I St/B OH I I St/B St/B St/B St/B
O0 / I St/B O3 / I St/B OH I St/B St/B
U1C0_DOUT O1
Data Sheet
16
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 54 P2.7 U0C1_ SELO0 U0C0_ SELO1 CC2_20 A20 U0C1_DX2C RxDC1C 55 P0.1 TxDC0 CCU61_ CC61 A1 U1C0_DX0B U1C0_DX1A 56 P2.8 U0C1_ SCLKOUT EXTCLK CC2_21 A21 U0C1_DX1D 57 P2.9 TxDC1 CC2_22 A22 CLKIN1 TCK_A
Data Sheet
Pin Definitions and Functions (cont'd) Ctrl. O1 O2 Type Function Bit 7 of Port 2, General Purpose Input/Output USIC0 Channel 1 Select/Control 0 Output USIC0 Channel 0 Select/Control 1 Output CAPCOM2 CC20IO Capture Inp./ Compare Out. External Bus Interface Address Line 20 USIC0 Channel 1 Shift Control Input CAN Node 1 Receive Data Input Bit 1 of Port 0, General Purpose Input/Output USIC1 Channel 0 Shift Data Output CAN Node 0 Transmit Data Output CCU61 Channel 1 Input/Output External Bus Interface Address Line 1 USIC1 Channel 0 Shift Data Input USIC1 Channel 0 Shift Clock Input St/B St/B O0 / I St/B
Symbol
O3 / I St/B OH I I St/B St/B St/B St/B St/B
O0 / I St/B O2
U1C0_DOUT O1
O3 / I St/B OH I I O1 O2 St/B St/B St/B
O0 / I DP/B Bit 8 of Port 2, General Purpose Input/Output DP/B USIC0 Channel 1 Shift Clock Output DP/B Programmable Clock Signal Output
1)
O3 / I DP/B CAPCOM2 CC21IO Capture Inp./ Compare Out. OH I DP/B External Bus Interface Address Line 21 DP/B USIC0 Channel 1 Shift Clock Input Bit 9 of Port 2, General Purpose Input/Output USIC0 Channel 1 Shift Data Output CAN Node 1 Transmit Data Output CAPCOM2 CC22IO Capture Inp./ Compare Out. External Bus Interface Address Line 22 Clock Signal Input JTAG Clock Input
17 V2.1, 2008-08
O0 / I St/B St/B St/B St/B St/B St/B O2 OH I I
U0C1_DOUT O1
O3 / I St/B
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 58 P0.2 U1C0_ SCLKOUT TxDC0 CCU61_ CC62 A2 U1C0_DX1B 59 P10.0 CCU60_ CC60 AD0 ESR1_2 U0C0_DX0A U0C1_DX0A 60 P10.1 CCU60_ CC61 AD1 U0C0_DX0B U0C0_DX1A Pin Definitions and Functions (cont'd) Ctrl. O1 O2 Type Function Bit 2 of Port 0, General Purpose Input/Output USIC1 Channel 0 Shift Clock Output CAN Node 0 Transmit Data Output CCU61 Channel 2 Input/Output External Bus Interface Address Line 2 USIC1 Channel 0 Shift Clock Input Bit 0 of Port 10, General Purpose Input/Output USIC0 Channel 1 Shift Data Output CCU60 Channel 0 Input/Output External Bus Interface Address/Data Line 0 ESR1 Trigger Input 2 USIC0 Channel 0 Shift Data Input USIC0 Channel 1 Shift Data Input Bit 1 of Port 10, General Purpose Input/Output USIC0 Channel 0 Shift Data Output CCU60 Channel 1 Input/Output External Bus Interface Address/Data Line 1 USIC0 Channel 0 Shift Data Input USIC0 Channel 0 Shift Clock Input St/B St/B O0 / I St/B
Symbol
O3 / I St/B OH I St/B St/B St/B
O0 / I St/B O2 / I St/B OH / I St/B I I I St/B St/B St/B St/B
U0C1_DOUT O1
O0 / I St/B O2 / I St/B OH / I St/B I I St/B St/B
U0C0_DOUT O1
Data Sheet
18
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 61 P0.3 U1C0_ SELO0 U1C1_ SELO1 CCU61_ COUT60 A3 U1C0_DX2A RxDC0B 62 P10.2 U0C0_ SCLKOUT CCU60_ CC62 AD2 U0C0_DX1B 63 P0.4 U1C1_ SELO0 U1C0_ SELO1 CCU61_ COUT61 A4 U1C1_DX2A RxDC1B 65 TRef Pin Definitions and Functions (cont'd) Ctrl. O1 O2 O3 OH I I O1 Type Function Bit 3 of Port 0, General Purpose Input/Output USIC1 Channel 0 Select/Control 0 Output USIC1 Channel 1 Select/Control 1 Output CCU61 Channel 0 Output External Bus Interface Address Line 3 USIC1 Channel 0 Shift Control Input CAN Node 0 Receive Data Input Bit 2 of Port 10, General Purpose Input/Output USIC0 Channel 0 Shift Clock Output CCU60 Channel 2 Input/Output External Bus Interface Address/Data Line 2 USIC0 Channel 0 Shift Clock Input Bit 4 of Port 0, General Purpose Input/Output USIC1 Channel 1 Select/Control 0 Output USIC1 Channel 0 Select/Control 1 Output CCU61 Channel 1 Output External Bus Interface Address Line 4 USIC1 Channel 1 Shift Control Input CAN Node 1 Receive Data Input
2)
Symbol
O0 / I St/B St/B St/B St/B St/B St/B St/B St/B
O0 / I St/B
O2 / I St/B OH / I St/B I O1 O2 O3 OH I I IO St/B St/B St/B St/B St/B St/B St/B Sp/1 O0 / I St/B
Control Pin for Core Voltage Generation
Data Sheet
19
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 66 P2.10 U0C0_ SELO3 CC2_23 A23 U0C1_DX0E CAPIN 67 P10.3 CCU60_ COUT60 AD3 U0C0_DX2A U0C1_DX2A 68 P0.5 U1C1_ SCLKOUT U1C0_ SELO2 CCU61_ COUT62 A5 U1C1_DX1A U1C0_DX1C 69 P10.4 U0C0_ SELO3 CCU60_ COUT61 AD4 U0C0_DX2B U0C1_DX2B
Data Sheet
Pin Definitions and Functions (cont'd) Ctrl. Type Function Bit 10 of Port 2, General Purpose Input/Output USIC0 Channel 1 Shift Data Output USIC0 Channel 0 Select/Control 3 Output CAPCOM2 CC23IO Capture Inp./ Compare Out. External Bus Interface Address Line 23 USIC0 Channel 1 Shift Data Input GPT2 Register CAPREL Capture Input Bit 3 of Port 10, General Purpose Input/Output CCU60 Channel 0 Output External Bus Interface Address/Data Line 3 USIC0 Channel 0 Shift Control Input USIC0 Channel 1 Shift Control Input Bit 5 of Port 0, General Purpose Input/Output USIC1 Channel 1 Shift Clock Output USIC1 Channel 0 Select/Control 2 Output CCU61 Channel 2 Output External Bus Interface Address Line 5 USIC1 Channel 1 Shift Clock Input USIC1 Channel 0 Shift Clock Input Bit 4 of Port 10, General Purpose Input/Output USIC0 Channel 0 Select/Control 3 Output CCU60 Channel 1 Output External Bus Interface Address/Data Line 4 USIC0 Channel 0 Shift Control Input USIC0 Channel 1 Shift Control Input
20 V2.1, 2008-08
Symbol
O0 / I St/B St/B St/B O2
U0C1_DOUT O1
O3 / I St/B OH I I O2 St/B St/B St/B St/B
O0 / I St/B
OH / I St/B I I O1 O2 O3 OH I I O1 O2 St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B
O0 / I St/B
O0 / I St/B
OH / I St/B I I St/B St/B
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 70 P10.5 U0C1_ SCLKOUT CCU60_ COUT62 AD5 U0C1_DX1B 71 P0.6 TxDC1 CCU61_ COUT63 A6 U1C1_DX0A CCU61_ CTRAPA U1C1_DX1B 72 P10.6 U1C0_ SELO0 AD6 U0C0_DX0C U1C0_DX2D CCU60_ CTRAPA Pin Definitions and Functions (cont'd) Ctrl. O1 O2 Type Function Bit 5 of Port 10, General Purpose Input/Output USIC0 Channel 1 Shift Clock Output CCU60 Channel 2 Output External Bus Interface Address/Data Line 5 USIC0 Channel 1 Shift Clock Input Bit 6 of Port 0, General Purpose Input/Output USIC1 Channel 1 Shift Data Output CAN Node 1 Transmit Data Output CCU61 Channel 3 Output External Bus Interface Address Line 6 USIC1 Channel 1 Shift Data Input CCU61 Emergency Trap Input USIC1 Channel 1 Shift Clock Input Bit 6 of Port 10, General Purpose Input/Output USIC0 Channel 0 Shift Data Output USIC1 Channel 0 Select/Control 0 Output External Bus Interface Address/Data Line 6 USIC0 Channel 0 Shift Data Input USIC1 Channel 0 Shift Control Input CCU60 Emergency Trap Input St/B St/B O0 / I St/B
Symbol
OH / I St/B I St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B O0 / I St/B O2 O3 OH I I I
U1C1_DOUT O1
O0 / I St/B O3
U0C0_DOUT O1
OH / I St/B I I I St/B St/B St/B
Data Sheet
21
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 73 P10.7 CCU60_ COUT63 AD7 U0C1_DX0B CCU60_ CCPOS0A 74 P0.7 U1C0_ SELO3 A7 U1C1_DX0B CCU61_ CTRAPB 78 P1.0 U1C0_ MCLKOUT U1C0_ SELO4 A8 ESR1_3 EX0BINA Pin Definitions and Functions (cont'd) Ctrl. Type Function Bit 7 of Port 10, General Purpose Input/Output USIC0 Channel 1 Shift Data Output CCU60 Channel 3 Output External Bus Interface Address/Data Line 7 USIC0 Channel 1 Shift Data Input CCU60 Position Input 0 Bit 7 of Port 0, General Purpose Input/Output USIC1 Channel 1 Shift Data Output USIC1 Channel 0 Select/Control 3 Output External Bus Interface Address Line 7 USIC1 Channel 1 Shift Data Input CCU61 Emergency Trap Input Bit 0 of Port 1, General Purpose Input/Output USIC1 Channel 0 Master Clock Output USIC1 Channel 0 Select/Control 4 Output External Bus Interface Address Line 8 ESR1 Trigger Input 3 External Interrupt Trigger Input St/B St/B O0 / I St/B O2
Symbol
U0C1_DOUT O1
OH / I St/B I I St/B St/B
O0 / I St/B St/B St/B St/B St/B St/B O2 OH I I
U1C1_DOUT O1
O0 / I St/B O1 O2 OH I I St/B St/B St/B St/B St/B
Data Sheet
22
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 79 P10.8 U0C0_ MCLKOUT U0C1_ SELO0 AD8 CCU60_ CCPOS1A U0C0_DX1C BRKIN_B 80 P10.9 U0C0_ SELO4 U0C1_ MCLKOUT AD9 CCU60_ CCPOS2A TCK_B 81 P1.1 U1C0_ SELO5 A9 ESR2_3 EX1BINA U2C1_DX0C Pin Definitions and Functions (cont'd) Ctrl. O1 O2 Type Function Bit 8 of Port 10, General Purpose Input/Output USIC0 Channel 0 Master Clock Output USIC0 Channel 1 Select/Control 0 Output External Bus Interface Address/Data Line 8 CCU60 Position Input 1 USIC0 Channel 0 Shift Clock Input OCDS Break Signal Input Bit 9 of Port 10, General Purpose Input/Output USIC0 Channel 0 Select/Control 4 Output USIC0 Channel 1 Master Clock Output External Bus Interface Address/Data Line 9 CCU60 Position Input 2 JTAG Clock Input Bit 1 of Port 1, General Purpose Input/Output USIC1 Channel 0 Select/Control 5 Output USIC2 Channel 1 Shift Data Output External Bus Interface Address Line 9 ESR2 Trigger Input 3 External Interrupt Trigger Input USIC2 Channel 1 Shift Data Input St/B St/B O0 / I St/B
Symbol
OH / I St/B I I I O1 O2 St/B St/B St/B St/B St/B
O0 / I St/B
OH / I St/B I I O2 St/B St/B St/B St/B St/B St/B St/B St/B
O0 / I St/B
U2C1_DOUT O3 OH I I I
Data Sheet
23
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 82 P10.10 U0C0_ SELO0 CCU60_ COUT63 AD10 U0C0_DX2C TDI_B U0C1_DX1A 83 P10.11 U1C0_ SCLKOUT BRKOUT AD11 U1C0_DX1D RxDC2B TMS_B 84 P1.2 U1C0_ SELO6 U2C1_ SCLKOUT A10 ESR1_4 CCU61_ T12HRB EX2AINA U2C1_DX0D U2C1_DX1C Pin Definitions and Functions (cont'd) Ctrl. O1 O2 Type Function Bit 10 of Port 10, General Purpose Input/Output USIC0 Channel 0 Select/Control 0 Output CCU60 Channel 3 Output External Bus Interface Address/Data Line 10 USIC0 Channel 0 Shift Control Input JTAG Test Data Input USIC0 Channel 1 Shift Clock Input Bit 11 of Port 10, General Purpose Input/Output USIC1 Channel 0 Shift Clock Output OCDS Break Signal Output External Bus Interface Address/Data Line 11 USIC1 Channel 0 Shift Clock Input CAN Node 2 Receive Data Input JTAG Test Mode Selection Input Bit 2 of Port 1, General Purpose Input/Output USIC1 Channel 0 Select/Control 6 Output USIC2 Channel 1 Shift Clock Output External Bus Interface Address Line 10 ESR1 Trigger Input 4 External Run Control Input for T12 of CCU61 External Interrupt Trigger Input USIC2 Channel 1 Shift Data Input USIC2 Channel 1 Shift Clock Input St/B St/B O0 / I St/B
Symbol
OH / I St/B I I I O1 O2 I I I O2 O3 OH I I I I I St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B
O0 / I St/B
OH / I St/B
O0 / I St/B
Data Sheet
24
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 85 P10.12 TxDC2 TDO_B AD12 U1C0_DX0C U1C0_DX1E 86 P10.13 U1C0_ SELO3 WR/WRL Pin Definitions and Functions (cont'd) Ctrl. Type Function Bit 12 of Port 10, General Purpose Input/Output USIC1 Channel 0 Shift Data Output CAN Node 2 Transmit Data Output JTAG Test Data Output External Bus Interface Address/Data Line 12 USIC1 Channel 0 Shift Data Input USIC1 Channel 0 Shift Clock Input Bit 13 of Port 10, General Purpose Input/Output USIC1 Channel 0 Shift Data Output USIC1 Channel 0 Select/Control 3 Output External Bus Interface Write Strobe Output Active for each external write access, when WR, active for ext. writes to the low byte, when WRL. USIC1 Channel 0 Shift Data Input Bit 3 of Port 1, General Purpose Input/Output USIC1 Channel 0 Select/Control 7 Output USIC2 Channel 0 Select/Control 4 Output External Bus Interface Address Line 11 ESR2 Trigger Input 4 External Interrupt Trigger Input Bit 14 of Port 10, General Purpose Input/Output USIC1 Channel 0 Select/Control 1 Output USIC0 Channel 1 Shift Data Output External Bus Interface Read Strobe Output ESR2 Trigger Input 2 USIC0 Channel 1 Shift Data Input St/B St/B St/B St/B St/B St/B St/B St/B O0 / I St/B O2 O3 I I
Symbol
U1C0_DOUT O1
OH / I St/B
O0 / I St/B O3 OH
U1C0_DOUT O1
U1C0_DX0D 87 P1.3 U1C0_ SELO7 U2C0_ SELO4 A11 ESR2_4 EX3AINA 89 P10.14 U1C0_ SELO1 RD ESR2_2 U0C1_DX0C
I O2 O3 OH I I O1
St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B
O0 / I St/B
O0 / I St/B
U0C1_DOUT O2 OH I I
Data Sheet
25
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 90 P1.4 U1C1_ SELO4 U2C0_ SELO5 A12 U2C0_DX2B 91 P10.15 U1C0_ SELO2 Pin Definitions and Functions (cont'd) Ctrl. O2 O3 OH I O1 Type Function Bit 4 of Port 1, General Purpose Input/Output USIC1 Channel 1 Select/Control 4 Output USIC2 Channel 0 Select/Control 5 Output External Bus Interface Address Line 12 USIC2 Channel 0 Shift Control Input Bit 15 of Port 10, General Purpose Input/Output USIC1 Channel 0 Select/Control 2 Output USIC0 Channel 1 Shift Data Output USIC1 Channel 0 Shift Data Output External Bus Interf. Addr. Latch Enable Output USIC0 Channel 1 Shift Clock Input Bit 5 of Port 1, General Purpose Input/Output USIC1 Channel 1 Select/Control 3 Output OCDS Break Signal Output External Bus Interface Address Line 13 USIC2 Channel 0 Shift Data Input Bit 6 of Port 1, General Purpose Input/Output USIC1 Channel 1 Select/Control 2 Output USIC2 Channel 0 Shift Data Output External Bus Interface Address Line 14 USIC2 Channel 0 Shift Data Input St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B St/B O0 / I St/B
Symbol
O0 / I St/B
U0C1_DOUT O2 U1C0_DOUT O3 ALE U0C1_DX1C 92 P1.5 U1C1_ SELO3 BRKOUT A13 U2C0_DX0C 93 P1.6 U1C1_ SELO2 A14 U2C0_DX0D OH I O2 O3 OH I O2
O0 / I St/B
O0 / I St/B
U2C0_DOUT O3 OH I
Data Sheet
26
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 94 P1.7 U1C1_ MCLKOUT U2C0_ SCLKOUT A15 U2C0_DX1C 95 96 XTAL2 XTAL1 Pin Definitions and Functions (cont'd) Ctrl. O2 O3 OH I O I Type Function Bit 7 of Port 1, General Purpose Input/Output USIC1 Channel 1 Master Clock Output USIC2 Channel 0 Shift Clock Output External Bus Interface Address Line 15 USIC2 Channel 0 Shift Clock Input Crystal Oscillator Amplifier Output Crystal Oscillator Amplifier Input To clock the device from an external source, drive XTAL1, while leaving XTAL2 unconnected. Voltages on XTAL1 must comply to the core supply voltage VDDI1. Power On Reset Input A low level at this pin resets the XC2365 completely. A spike filter suppresses input pulses <10 ns. Input pulses >100 ns safely pass the filter. The minimum duration for a safe recognition should be 120 ns. An internal pullup device will hold this pin high when nothing is driving it. External Service Request 1 USIC1 Channel 0 Shift Data Input USIC1 Channel 0 Shift Control Input USIC1 Channel 1 Shift Data Input USIC1 Channel 1 Shift Control Input USIC2 Channel 1 Shift Control Input External Interrupt Trigger Input External Service Request 0 Note: After power-up, ESR0 operates as opendrain bidirectional reset with a weak pull-up. U1C0_DX0E U1C0_DX2B I I St/B St/B USIC1 Channel 0 Shift Data Input USIC1 Channel 0 Shift Control Input St/B St/B St/B St/B Sp/1 Sp/1 O0 / I St/B
Symbol
97
PORST
I
In/B
98
ESR1 U1C0_DX0F U1C0_DX2C U1C1_DX0C U1C1_DX2B U2C1_DX2C EX0AINB
O0 / I St/B I I I I I I St/B St/B St/B St/B St/B St/B
99
ESR0
O0 / I St/B
Data Sheet
27
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
General Device Information Table 4 Pin 10 Pin Definitions and Functions (cont'd) Ctrl. Type Function PS/M Digital Core Supply Voltage for Domain M Decouple with a ceramic capacitor, see Table 12 for details. PS/1 Digital Core Supply Voltage for Domain 1 Decouple with a ceramic capacitor, see Table 12 for details. All VDDI1 pins must be connected to each other. PS/A Digital Pad Supply Voltage for Domain A Connect decoupling capacitors to adjacent VDDP/VSS pin pairs as close as possible to the pins. Note: The A/D_Converters and ports P5, P6, and P15 are fed from supply voltage VDDPA. 2, 25, 27, 50, 52, 75, 77, 100 1, 26, 51, 76
Symbol
VDDIM VDDI1
38, 64, 88 14
-
VDDPA
-
VDDPB
-
PS/B Digital Pad Supply Voltage for Domain B Connect decoupling capacitors to adjacent VDDP/VSS pin pairs as close as possible to the pins. Note: The on-chip voltage regulators and all ports except P5, P6, and P15 are fed from supply voltage VDDPB.
VSS
-
PS/-- Digital Ground All VSS pins must be connected to the ground-line or ground-plane. Note: Also the exposed pad is connected to VSS. The respective board area must be connected to ground (if soldered) or left free.
1) To generate the reference clock output for bus timing measurement, fSYS must be selected as source for EXTCLK and P2.8 must be selected as output pin. Also the high-speed clock pad must be enabled. This configuration is referred to as reference clock output signal CLKOUT. 2) Pin TRef was used to control the core voltage generation in step AA. For that step, pin TRef must be connected to VDDPB. This connection is no more required from step AB on. For the current step, pin TRef is logically not connected. Future derivatives will feature an additional general purpose IO pin at this position.
Data Sheet
28
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3
Functional Description
The architecture of the XC2365 combines advantages of RISC, CISC, and DSP processors with an advanced peripheral subsystem in a well-balanced design. On-chip memory blocks allow the design of compact systems-on-silicon with maximum performance suited for computing, control, and communication. The on-chip memory blocks (program code memory and SRAM, dual-port RAM, data SRAM) and the generic peripherals are connected to the CPU by separate high-speed buses. Another bus, the LXBus, connects additional on-chip resources and external resources (see Figure 3). This bus structure enhances overall system performance by enabling the concurrent operation of several subsystems of the XC2365. The block diagram gives an overview of the on-chip components and the advanced internal bus structure of the XC2365.
PSRAM 8/16/32 Kbytes Program Flash 0 256 Kbytes
DPRAM 2 Kbytes
DSRAM 16 Kbytes
OCDS Debug Support EBC LXBus Control External Bus Control
IMB
C166SV2 - Core Program Flash 2 0/64 Kbytes System Functions Clock, Reset, Stand-By RAM
DMU
Program Flash 1 128/192/256 Kbytes
PMU
CPU
XTAL
Interrupt & PEC Interrupt Bus
RTC
ADC1 ADC0 8-Bit/ 8-Bit/ 10-Bit 10-Bit 8 Ch. 8 Ch.
GPT T2 T3 T4 T5 T6 BRGen
CC2 T7 T8
CCU61 CCU60 T12 T13 T12 T13
Peripher al Data Bus
USIC2 USIC1 USIC0 2 Ch., 2 Ch., 2 Ch., 64 x 64 x 64 x Buffer Buffer Buffer
M ulti CAN
RS232, RS232, RS232, LIN, LIN, LIN, 3 ch. SPI, SPI, SPI, IIC, IIS IIC, IIS IIC, IIS P10 16 P7 P6 5 3 P4 4 P2 13 P1 8 P0 8
P15 5
Port 5 11
MC_XC236X_BLOCKDIAGRAM
Figure 3
Data Sheet
Block Diagram
29 V2.1, 2008-08
LXBus
WDT
XC2365 XC2000 Family Derivatives
Functional Description
3.1
Memory Subsystem and Organization
The memory space of the XC2365 is configured in the von Neumann architecture. In this architecture all internal and external resources, including code memory, data memory, registers and I/O ports, are organized in the same linear address space. Table 5 XC2365 Memory Map Start Loc. FF'FF00H End Loc. FF'FFFFH FF'FEFFH EF'FFFFH E8'7FFFH E7'FFFFH E0'7FFFH DF'FFFFH C8'FFFFH C7'FFFFH C3'FFFFH BF'FFFFH 3F'FFFFH 20'57FFH 20'3FFFH 1F'FFFFH 00'FFFFH 00'FDFFH 00'F5FFH 00'F1FFH 00'EFFFH 00'DFFFH 00'9FFFH 00'7FFFH Area Size1) 256 Bytes <1 Mbyte 480 Kbytes 32 Kbytes 480 Kbytes 32 Kbytes 64 Kbytes 256 Kbytes 256 Kbytes 8 Mbytes < 2 Mbytes 6 Kbytes 16 Kbytes < 2 Mbytes 0.5 Kbyte 2 Kbytes 1 Kbyte 0.5 Kbyte 4 Kbytes 16 Kbytes 8 Kbytes 32 Kbytes Notes - Minus IMB registers Mirrors EPSRAM Flash timing Mirrors PSRAM Maximum speed - -
2)
Address Area IMB register space
Reserved (Access trap) F0'0000H Reserved for EPSRAM E8'8000H Emulated PSRAM Reserved for PSRAM Program SRAM Reserved for pr. mem. Program Flash 2 Program Flash 1 Program Flash 0 External memory area USIC registers MultiCAN registers External memory area SFR area Dual-Port RAM Reserved for DPRAM ESFR area XSFR area Data SRAM Reserved for DSRAM External memory area E8'0000H E0'8000H E0'0000H C9'0000H C8'0000H C4'0000H C0'0000H 40'0000H 20'4000H 20'0000H 01'0000H 00'FE00H 00'F600H 00'F200H 00'F000H 00'E000H 00'A000H 00'8000H 00'0000H
<1.25 Mbytes -
- Minus USIC/CAN Accessed via EBC Accessed via EBC Minus segment 0 - - - - - - - -
Available Ext. IO area3) 20'5800H
1) The areas marked with "<" are slightly smaller than indicated. See column "Notes". 2) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0'F000H to C0'FFFFH). 3) Several pipeline optimizations are not active within the external IO area. This is necessary to control external peripherals properly.
Data Sheet
30
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description This common memory space consists of 16 Mbytes organized as 256 segments of 64 Kbytes; each segment contains four data pages of 16 Kbytes. The entire memory space can be accessed bytewise or wordwise. Portions of the on-chip DPRAM and the register spaces (ESFR/SFR) additionally are directly bit addressable. The internal data memory areas and the Special Function Register areas (SFR and ESFR) are mapped into segment 0, the system segment. The Program Management Unit (PMU) handles all code fetches and, therefore, controls access to the program memories such as Flash memory and PSRAM. The Data Management Unit (DMU) handles all data transfers and, therefore, controls access to the DSRAM and the on-chip peripherals. Both units (PMU and DMU) are connected to the high-speed system bus so that they can exchange data. This is required if operands are read from program memory, code or data is written to the PSRAM, code is fetched from external memory, or data is read from or written to external resources. These include peripherals on the LXBus such as USIC or MultiCAN. The system bus allows concurrent two-way communication for maximum transfer performance. Up to 32 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data. The PSRAM is accessed via the PMU and is optimized for code fetches. A section of the PSRAM with programmable size can be write-protected. Note: The actual size of the PSRAM depends on the chosen derivative (see Table 1). 16 Kbytes of on-chip Data SRAM (DSRAM) are used for storage of general user data. The DSRAM is accessed via a separate interface and is optimized for data access. 2 Kbytes of on-chip Dual-Port RAM (DPRAM) provide storage for user-defined variables, for the system stack, and for general purpose register banks. A register bank can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0, ..., RL7, RH7) General Purpose Registers (GPRs). The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR, any location in the DPRAM is bit addressable. 1 Kbyte of on-chip Stand-By SRAM (SBRAM) provides storage for system-relevant user data that must be preserved while the major part of the device is powered down. The SBRAM is accessed via a specific interface and is powered in domain M.
Data Sheet
31
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description 1024 bytes (2 x 512 bytes) of the address space are reserved for the Special Function Register areas (SFR space and ESFR space). SFRs are word-wide registers which are used to control and monitor functions of the different on-chip units. Unused SFR addresses are reserved for future members of the XC2000 Family. In order to to ensure upward compatibility they should either not be accessed or written with zeros. In order to meet the requirements of designs where more memory is required than is available on chip, up to 12 Mbytes (approximately, see Table 5) of external RAM and/or ROM can be connected to the microcontroller. The External Bus Interface also provides access to external peripherals. Up to 576 Kbytes of on-chip Flash memory store code, constant data, and control data. The on-chip Flash memory consists of up to three modules with a maximum capacity of 256 Kbytes each. Each module is organized in 4-Kbyte sectors. The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used internally to store operation control parameters and protection information. Note: The actual size of the Flash memory depends on the chosen derivative (see Table 1). Each sector can be separately write protected1), erased and programmed (in blocks of 128 Bytes). The complete Flash area can be read-protected. A user-defined password sequence temporarily unlocks protected areas. The Flash modules combine 128-bit read access with protected and efficient writing algorithms for programming and erasing. Dynamic error correction provides extremely high read data security for all read access operations. Access to different Flash modules can be executed in parallel. For Flash parameters, please see Section 4.5.
1) To save control bits, sectors are clustered for protection purposes, they remain separate for programming/erasing.
Data Sheet
32
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.2
External Bus Controller
All external memory access operations are performed by a special on-chip External Bus Controller (EBC). The EBC also controls access to resources connected to the on-chip LXBus (MultiCAN and the USIC modules). The LXBus is an internal representation of the external bus that allows access to integrated peripherals and modules in the same way as to external components. The EBC can be programmed either to Single Chip Mode, when no external memory is required, or to an external bus mode with the following selections1): * * * Address Bus Width with a range of 0 ... 24-bit Data Bus Width 8-bit or 16-bit Bus Operation Multiplexed or Demultiplexed
The bus interface uses Port 10 and Port 2 for addresses and data. In the demultiplexed bus modes, the lower addresses are output separately on Port 0 and Port 1. The number of active segment address lines is selectable, restricting the external address space to 8 Mbytes ... 64 Kbytes. This is required when interface lines shall be assigned to Port 2. Up to four external CS signals (three windows plus default) can be generated and output on Port 4 in order to save external glue logic. External modules can be directly connected to the common address/data bus and their individual select lines. Important timing characteristics of the external bus interface are programmable (with registers TCONCSx/FCONCSx) to allow the user to adapt it to a wide range of different types of memories and external peripherals. Access to very slow memories or modules with varying access times is supported by a special `Ready' function. The active level of the control input signal is selectable. In addition, up to four independent address windows may be defined (using registers ADDRSELx) to control access to resources with different bus characteristics. These address windows are arranged hierarchically where window 4 overrides window 3, and window 2 overrides window 1. All accesses to locations not covered by these four address windows are controlled by TCONCS0/FCONCS0. The currently active window can generate a chip select signal. The external bus timing is based on the rising edge of the reference clock output CLKOUT. The external bus protocol is compatible with that of the standard C166 Family.
1) Bus modes are switched dynamically if several address windows with different mode settings are used.
Data Sheet
33
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.3
Central Processing Unit (CPU)
The core of the CPU consists of a 5-stage execution pipeline with a 2-stage instructionfetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and accumulate unit (MAC), a register-file providing three register banks, and dedicated SFRs. The ALU features a multiply-and-divide unit, a bit-mask generator, and a barrel shifter.
PMU CPU Prefetch Unit Branch Unit FIFO IDX0 IDX1 QX0 QX1 +/Multiply Unit +/MAH MAC CSP IP VECSEG TFR Injection/ Exception Handler IFU DPP0 DPP1 DPP2 DPP3 SPSEG SP STKOV STKUN CP R15 R15 R14 R15 R14 R14 GPRs GPRs GPRs R1 R1 R0 R1 R0 R0 RF
2-Stage Prefetch Pipeline 5-Stage Pipeline
PSRAM Flash/ROM
CPUCON1 CPUCON2
DPRAM
Return Stack QR0 QR1
IPIP
R15 R14 GPRs R1 R0
+/MRW MCW MSW MAL
Division Unit Multiply Unit
ADU
Bit-Mask-Gen. Barrel-Shifter
MDC PSW MDH ZEROS +/MDL ONES ALU
Buffer WB DMU
DSRAM EBC Peripherals
mca04917_x.vsd
Figure 4
CPU Block Diagram
Data Sheet
34
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description With this hardware most XC2365 instructions can be executed in a single machine cycle of 12.5 ns with a 80 MHz CPU clock. For example, shift and rotate instructions are always processed during one machine cycle, no matter how many bits are shifted. Also, multiplication and most MAC instructions execute in one cycle. All multiple-cycle instructions have been optimized so that they can be executed very fast; for example, a 32-/16-bit division is started within 4 cycles while the remaining cycles are executed in the background. Another pipeline optimization, the branch target prediction, eliminates the execution time of branch instructions if the prediction was correct. The CPU has a register context consisting of up to three register banks with 16 wordwide GPRs each at its disposal. One of these register banks is physically allocated within the on-chip DPRAM area. A Context Pointer (CP) register determines the base address of the active register bank accessed by the CPU at any time. The number of these register bank copies is only restricted by the available internal RAM space. For easy parameter passing, a register bank may overlap others. A system stack of up to 32 Kwords is provided for storage of temporary data. The system stack can be allocated to any location within the address space (preferably in the on-chip RAM area); it is accessed by the CPU with the stack pointer (SP) register. Two separate SFRs, STKOV and STKUN, are implicitly compared with the stack pointer value during each stack access to detect stack overflow or underflow. The high performance of the CPU hardware implementation can be best utilized by the programmer with the highly efficient XC2365 instruction set. This includes the following instruction classes: * * * * * * * * * * * * * Standard Arithmetic Instructions DSP-Oriented Arithmetic Instructions Logical Instructions Boolean Bit Manipulation Instructions Compare and Loop Control Instructions Shift and Rotate Instructions Prioritize Instruction Data Movement Instructions System Stack Instructions Jump and Call Instructions Return Instructions System Control Instructions Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes and words. A variety of direct, indirect or immediate addressing modes are provided to specify the required operands.
Data Sheet
35
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.4
Interrupt System
With a minimum interrupt response time of 7/111) CPU clocks (in the case of internal program execution), the XC2365 can react quickly to the occurrence of non-deterministic events. The architecture of the XC2365 supports several mechanisms for fast and flexible response to service requests; these can be generated from various sources internal or external to the microcontroller. Any of these interrupt requests can be programmed to be serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC). Where in a standard interrupt service the current program execution is suspended and a branch to the interrupt vector table is performed, just one cycle is `stolen' from the current CPU activity to perform a PEC service. A PEC service implies a single byte or word data transfer between any two memory locations with an additional increment of either the PEC source pointer, the destination pointer, or both. An individual PEC transfer counter is implicitly decremented for each PEC service except when performing in the continuous transfer mode. When this counter reaches zero, a standard interrupt is performed to the corresponding source-related vector location. PEC services are particularly well suited to supporting the transmission or reception of blocks of data. The XC2365 has eight PEC channels, each whith fast interrupt-driven data transfer capabilities. Each of the possible interrupt nodes has a separate control register containing an interrupt request flag, an interrupt enable flag and an interrupt priority bitfield. Each node can be programmed by its related register to one of sixteen interrupt priority levels. Once accepted by the CPU, an interrupt service can only be interrupted by a higher-priority service request. For standard interrupt processing, each possible interrupt node has a dedicated vector location. Fast external interrupt inputs can service external interrupts with high-precision requirements. These fast interrupt inputs feature programmable edge detection (rising edge, falling edge, or both edges). Software interrupts are supported by the `TRAP' instruction in combination with an individual trap (interrupt) number. Table 6 shows all of the possible XC2365 interrupt sources and the corresponding hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers. Note: Interrupt nodes which are not assigned to peripherals (unassigned nodes) may be used to generate software-controlled interrupt requests by setting the respective interrupt request bit (xIR).
1) Depending if the jump cache is used or not.
Data Sheet
36
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description Table 6 XC2365 Interrupt Nodes Control Register CC2_CC16IC CC2_CC17IC CC2_CC18IC CC2_CC19IC CC2_CC20IC CC2_CC21IC CC2_CC22IC CC2_CC23IC CC2_CC24IC CC2_CC25IC CC2_CC26IC CC2_CC27IC CC2_CC28IC CC2_CC29IC CC2_CC30IC CC2_CC31IC GPT12E_T2IC GPT12E_T3IC GPT12E_T4IC
37
Source of Interrupt or PEC Service Request CAPCOM Register 16, or ERU Request 0 CAPCOM Register 17, or ERU Request 1 CAPCOM Register 18, or ERU Request 2 CAPCOM Register 19, or ERU Request 3 CAPCOM Register 20, or USIC0 Request 6 CAPCOM Register 21, or USIC0 Request 7 CAPCOM Register 22, or USIC1 Request 6 CAPCOM Register 23, or USIC1 Request 7 CAPCOM Register 24, or ERU Request 0 CAPCOM Register 25, or ERU Request 1 CAPCOM Register 26, or ERU Request 2 CAPCOM Register 27, or ERU Request 3 CAPCOM Register 28, or USIC2 Request 6 CAPCOM Register 29, or USIC2 Request 7 CAPCOM Register 30 CAPCOM Register 31 GPT1 Timer 2 GPT1 Timer 3 GPT1 Timer 4
Data Sheet
Vector Location1) xx'0040H xx'0044H xx'0048H xx'004CH xx'0050H xx'0054H xx'0058H xx'005CH xx'0060H xx'0064H xx'0068H xx'006CH xx'0070H xx'0074H xx'0078H xx'007CH xx'0080H xx'0084H xx'0088H
Trap Number 10H / 16D 11H / 17D 12H / 18D 13H / 19D 14H / 20D 15H / 21D 16H / 22D 17H / 23D 18H / 24D 19H / 25D 1AH / 26D 1BH / 27D 1CH / 28D 1DH / 29D 1EH / 30D 1FH / 31D 20H / 32D 21H / 33D 22H / 34D
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description Table 6 XC2365 Interrupt Nodes (cont'd) Control Register GPT12E_T5IC GPT12E_T6IC GPT12E_CRIC CC2_T7IC CC2_T8IC ADC_0IC ADC_1IC ADC_2IC ADC_3IC ADC_4IC ADC_5IC ADC_6IC ADC_7IC CCU60_0IC CCU60_1IC CCU60_2IC CCU60_3IC CCU61_0IC CCU61_1IC CCU61_2IC CCU61_3IC - - - - - - - - CAN_0IC
38
Source of Interrupt or PEC Service Request GPT2 Timer 5 GPT2 Timer 6 GPT2 CAPREL Register CAPCOM Timer 7 CAPCOM Timer 8 A/D Converter Request 0 A/D Converter Request 1 A/D Converter Request 2 A/D Converter Request 3 A/D Converter Request 4 A/D Converter Request 5 A/D Converter Request 6 A/D Converter Request 7 CCU60 Request 0 CCU60 Request 1 CCU60 Request 2 CCU60 Request 3 CCU61 Request 0 CCU61 Request 1 CCU61 Request 2 CCU61 Request 3 Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node CAN Request 0
Data Sheet
Vector Location1) xx'008CH xx'0090H xx'0094H xx'0098H xx'009CH xx'00A0H xx'00A4H xx'00A8H xx'00ACH xx'00B0H xx'00B4H xx'00B8H xx'00BCH xx'00C0H xx'00C4H xx'00C8H xx'00CCH xx'00D0H xx'00D4H xx'00D8H xx'00DCH xx'00E0H xx'00E4H xx'00E8H xx'00ECH xx'00F0H xx'00F4H xx'00F8H xx'00FCH xx'0100H
Trap Number 23H / 35D 24H / 36D 25H / 37D 26H / 38D 27H / 39D 28H / 40D 29H / 41D 2AH / 42D 2BH / 43D 2CH / 44D 2DH / 45D 2EH / 46D 2FH / 47D 30H / 48D 31H / 49D 32H / 50D 33H / 51D 34H / 52D 35H / 53D 36H / 54D 37H / 55D 38H / 56D 39H / 57D 3AH / 58D 3BH / 59D 3CH / 60D 3DH / 61D 3EH / 62D 3FH / 63D 40H / 64D
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description Table 6 XC2365 Interrupt Nodes (cont'd) Control Register CAN_1IC CAN_2IC CAN_3IC CAN_4IC CAN_5IC CAN_6IC CAN_7IC CAN_8IC CAN_9IC CAN_10IC CAN_11IC CAN_12IC CAN_13IC CAN_14IC CAN_15IC U0C0_0IC U0C0_1IC U0C0_2IC U0C1_0IC U0C1_1IC U0C1_2IC U1C0_0IC U1C0_1IC U1C0_2IC U1C1_0IC U1C1_1IC U1C1_2IC U2C0_0IC U2C0_1IC U2C0_2IC
39
Source of Interrupt or PEC Service Request CAN Request 1 CAN Request 2 CAN Request 3 CAN Request 4 CAN Request 5 CAN Request 6 CAN Request 7 CAN Request 8 CAN Request 9 CAN Request 10 CAN Request 11 CAN Request 12 CAN Request 13 CAN Request 14 CAN Request 15 USIC0 Cannel 0, Request 0 USIC0 Cannel 0, Request 1 USIC0 Cannel 0, Request 2 USIC0 Cannel 1, Request 0 USIC0 Cannel 1, Request 1 USIC0 Cannel 1, Request 2 USIC1 Cannel 0, Request 0 USIC1 Cannel 0, Request 1 USIC1 Cannel 0, Request 2 USIC1 Cannel 1, Request 0 USIC1 Cannel 1, Request 1 USIC1 Cannel 1, Request 2 USIC2 Cannel 0, Request 0 USIC2 Cannel 0, Request 1 USIC2 Cannel 0, Request 2
Data Sheet
Vector Location1) xx'0104H xx'0108H xx'010CH xx'0110H xx'0114H xx'0118H xx'011CH xx'0120H xx'0124H xx'0128H xx'012CH xx'0130H xx'0134H xx'0138H xx'013CH xx'0140H xx'0144H xx'0148H xx'014CH xx'0150H xx'0154H xx'0158H xx'015CH xx'0160H xx'0164H xx'0168H xx'016CH xx'0170H xx'0174H xx'0178H
Trap Number 41H / 65D 42H / 66D 43H / 67D 44H / 68D 45H / 69D 46H / 70D 47H / 71D 48H / 72D 49H / 73D 4AH / 74D 4BH / 75D 4CH / 76D 4DH / 77D 4EH / 78D 4FH / 79D 50H / 80D 51H / 81D 52H / 82D 53H / 83D 54H / 84D 55H / 85D 56H / 86D 57H / 87D 58H / 88D 59H / 89D 5AH / 90D 5BH / 91D 5CH / 92D 5DH / 93D 5EH / 94D
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description Table 6 XC2365 Interrupt Nodes (cont'd) Control Register U2C1_0IC U2C1_1IC U2C1_2IC - - - - - - - - - SCU_1IC SCU_0IC PFM_IC RTC_IC EOPIC Vector Location1) xx'017CH xx'0180H xx'0184H xx'0188H xx'018CH xx'0190H xx'0194H xx'0198H xx'019CH xx'01A0H xx'01A4H xx'01A8H xx'01ACH xx'01B0H xx'01B4H xx'01B8H xx'01BCH Trap Number 5FH / 95D 60H / 96D 61H / 97D 62H / 98D 63H / 99D 64H / 100D 65H / 101D 66H / 102D 67H / 103D 68H / 104D 69H / 105D 6AH / 106D 6BH / 107D 6CH / 108D 6DH / 109D 6EH / 110D 6FH / 111D
Source of Interrupt or PEC Service Request USIC2 Cannel 1, Request 0 USIC2 Cannel 1, Request 1 USIC2 Cannel 1, Request 2 Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node Unassigned node SCU Request 1 SCU Request 0 Program Flash Modules RTC End of PEC Subchannel
1) Register VECSEG defines the segment where the vector table is located. Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table represents the default setting with a distance of 4 (two words) between two vectors.
Data Sheet
40
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description The XC2365 includes an excellent mechanism to identify and process exceptions or error conditions that arise during run-time, the so-called `Hardware Traps'. A hardware trap causes an immediate non-maskable system reaction similar to a standard interrupt service (branching to a dedicated vector table location). The occurrence of a hardware trap is also indicated by a single bit in the trap flag register (TFR). Unless another higherpriority trap service is in progress, a hardware trap will interrupt any ongoing program execution. In turn, hardware trap services can normally not be interrupted by standard or PEC interrupts. Table 7 shows all possible exceptions or error conditions that can arise during runtime: Table 7 Trap Summary Trap Flag - SR0 STKOF STKUF SOFTBRK SR1 UNDOPC ACER PRTFLT ILLOPA - - Trap Vector RESET SR0TRAP STOTRAP STUTRAP SBRKTRAP BTRAP BTRAP BTRAP BTRAP BTRAP - - Vector Trap Trap 1) Number Priority Location xx'0000H xx'0008H xx'0010H xx'0018H xx'0020H xx'0028H xx'0028H xx'0028H xx'0028H xx'0028H 00H 02H 04H 06H 08H 0AH 0AH 0AH 0AH 0AH III II II II II I I I I I - Current CPU Priority
Exception Condition Reset Functions Class A Hardware Traps: * System Request 0 * Stack Overflow * Stack Underflow * Software Break Class B Hardware Traps: * System Request 1 * Undefined Opcode * Memory Access Error * Protected Instruction Fault * Illegal Word Operand Access Reserved Software Traps: * TRAP Instruction
[2CH - 3CH] [0BH 0FH] Any Any [xx'0000H - [00H xx'01FCH] 7FH] in steps of 4H
1) Register VECSEG defines the segment where the vector table is located to. Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table represents the default setting, with a distance of 4 (two words) between two vectors.
Data Sheet
41
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.5
On-Chip Debug Support (OCDS)
The On-Chip Debug Support system built into the XC2365 provides a broad range of debug and emulation features. User software running on the XC2365 can be debugged within the target system environment. The OCDS is controlled by an external debugging device via the debug interface. This consists of the JTAG port conforming to IEEE-1149. The debug interface can be completed with an optional break interface. The debugger controls the OCDS with a set of dedicated registers accessible via the debug interface (JTAG). In addition the OCDS system can be controlled by the CPU, e.g. by a monitor program. An injection interface allows the execution of OCDS-generated instructions by the CPU. Multiple breakpoints can be triggered by on-chip hardware, by software, or by an external trigger input. Single stepping is supported, as is the injection of arbitrary instructions and read/write access to the complete internal address space. A breakpoint trigger can be answered with a CPU halt, a monitor call, a data transfer, or/and the activation of an external signal. Tracing data can be obtained via the debug interface, or via the external bus interface for increased performance. The JTAG interface uses four interface signals, to communicate with external circuitry. The debug interface can be amended with two optional break lines.
Data Sheet
42
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.6
Capture/Compare Unit (CAPCOM2)
The CAPCOM2 unit supports generation and control of timing sequences on up to 16 channels with a maximum resolution of one system clock cycle (eight cycles in staggered mode). The CAPCOM2 unit is typically used to handle high-speed I/O tasks such as pulse and waveform generation, pulse width modulation (PWM), digital to analog (D/A) conversion, software timing, or time recording with respect to external events. Two 16-bit timers (T7/T8) with reload registers provide two independent time bases for the capture/compare register array. The input clock for the timers is programmable to a number of prescaled values of the internal system clock. It may also be derived from an overflow/underflow of timer T6 in module GPT2. This provides a wide range for the timer period and resolution while allowing precise adjustments for application-specific requirements. An external count input for CAPCOM2 timer T7 allows event scheduling for the capture/compare registers with respect to external events. The capture/compare register array contains 16 dual purpose capture/compare registers. Each may be individually allocated to either CAPCOM2 timer T7 or T8 and programmed for a capture or compare function. 12 registers of the CAPCOM2 module have one port pin associated with it. This serves as an input pin to trigger the capture function or as an output pin to indicate the occurrence of a compare event. Table 8 Mode 0 Mode 1 Mode 2 Mode 3 Double Register Mode Single Event Mode Compare Modes (CAPCOM2) Function Interrupt-only compare mode; Several compare interrupts per timer period are possible Pin toggles on each compare match; Several compare events per timer period are possible Interrupt-only compare mode; Only one compare interrupt per timer period is generated Pin set `1' on match; pin reset `0' on compare timer overflow; Only one compare event per timer period is generated Two registers operate on one pin; Pin toggles on each compare match; Several compare events per timer period are possible Generates single edges or pulses; Can be used with any compare mode
Compare Modes
Data Sheet
43
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description When a capture/compare register has been selected for capture mode, the current contents of the allocated timer will be latched (`captured') into the capture/compare register in response to an external event at the port pin associated with this register. In addition, a specific interrupt request for this capture/compare register is generated. Either a positive, a negative, or both a positive and a negative external signal transition at the pin can be selected as the triggering event. The contents of all registers selected for one of the five compare modes are continuously compared with the contents of the allocated timers. When a match occurs between the timer value and the value in a capture/compare register, specific actions will be taken based on the compare mode selected.
Data Sheet
44
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
Reload Reg . T7REL
fCC
T7IN T6OUF CC16IO CC17IO
T7 Input Control
Timer T7
T7IRQ
CC16IRQ CC17IRQ Mode Control (Capture or Compare) Sixteen 16-bit Capture/ Compare Registers CC31IRQ T8 Input Control
CC31IO
fCC
T6OUF
Timer T8
T8IRQ
Reload Reg . T8REL
MC_CAPCOM2_BLOCKDIAG
Figure 5
CAPCOM2 Unit Block Diagram
Data Sheet
45
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.7
Capture/Compare Units CCU6x
The XC2365 features two CCU6 units (CCU60, CCU61). The CCU6 is a high-resolution capture and compare unit with application-specific modes. It provides inputs to start the timers synchronously, an important feature in devices with several CCU6 modules. The module provides two independent timers (T12, T13), that can be used for PWM generation, especially for AC motor control. Additionally, special control modes for block commutation and multi-phase machines are supported. Timer 12 Features * * * * * * * * * * Three capture/compare channels, where each channel can be used either as a capture or as a compare channel. Supports generation of a three-phase PWM (six outputs, individual signals for highside and low-side switches) 16-bit resolution, maximum count frequency = peripheral clock Dead-time control for each channel to avoid short circuits in the power stage Concurrent update of the required T12/13 registers Center-aligned and edge-aligned PWM can be generated Single-shot mode supported Many interrupt request sources Hysteresis-like control mode Automatic start on a HW event (T12HR, for synchronization purposes)
Timer 13 Features * * * * * * One independent compare channel with one output 16-bit resolution, maximum count frequency = peripheral clock Can be synchronized to T12 Interrupt generation at period match and compare match Single-shot mode supported Automatic start on a HW event (T13HR, for synchronization purposes)
Additional Features * * * * * * * Block commutation for brushless DC drives implemented Position detection via Hall sensor pattern Automatic rotational speed measurement for block commutation Integrated error handling Fast emergency stop without CPU load via external signal (CTRAP) Control modes for multi-channel AC drives Output levels can be selected and adapted to the power stage
Data Sheet
46
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
CCU6 Module Kernel fSYS TxHR T12
com pare
Channel 0 Channel 1 Channel 2
capture
1
1
Deadtime Control
Multichannel Control
output select
Trap Control
1
Hal l i nput
T13
Channel 3
com pare 1
3
2
2
2
3
trap i nput
1
compa re
compa re
Input / Output Control
compa re
Interrupts
st art
CCPOS0 CCPOS1 CCPOS2
COUT63
COUT60 CC60 COUT61 CC61 COUT62 CC62
m c_ccu6_blockdiagram . vsd
Figure 6
CCU6 Block Diagram
Timer T12 can work in capture and/or compare mode for its three channels. The modes can also be combined. Timer T13 can work in compare mode only. The multi-channel control unit generates output patterns that can be modulated by timer T12 and/or timer T13. The modulation sources can be selected and combined for signal modulation.
Data Sheet
47
CTRAP
V2.1, 2008-08
output select
XC2365 XC2000 Family Derivatives
Functional Description
3.8
General Purpose Timer (GPT12E) Unit
The GPT12E unit is a very flexible multifunctional timer/counter structure which can be used for many different timing tasks such as event timing and counting, pulse width and duty cycle measurements, pulse generation, or pulse multiplication. The GPT12E unit incorporates five 16-bit timers organized in two separate modules, GPT1 and GPT2. Each timer in each module may either operate independently in a number of different modes or be concatenated with another timer of the same module. Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for one of four basic modes of operation: Timer, Gated Timer, Counter, and Incremental Interface Mode. In Timer Mode, the input clock for a timer is derived from the system clock and divided by a programmable prescaler. Counter Mode allows timer clocking in reference to external events. Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the operation of a timer is controlled by the `gate' level on an external input pin. For these purposes each timer has one associated port pin (TxIN1)) which serves as a gate or clock input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles. The counting direction (up/down) for each timer can be programmed by software or altered dynamically by an external signal on a port pin (TxEUD1)), e.g. to facilitate position tracking. In Incremental Interface Mode the GPT1 timers1) can be directly connected to the incremental position sensor signals A and B through their respective inputs TxIN and TxEUD. Direction and counting signals are internally derived from these two input signals, so that the contents of the respective timer Tx corresponds to the sensor position. The third position sensor signal TOP0 can be connected to an interrupt input. Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out monitoring of external hardware components. It may also be used internally to clock timers T2 and T4 for measuring long time periods with high resolution. In addition to the basic operating modes, T2 may be configured as reload or capture register for timer T3. A timer used as capture or reload register is stopped. The contents of timer T3 is captured into T2 in response to a signal at the associated input pin (TxIN). Timer T3 is reloaded with the contents of T2, triggered either by an external signal or a selectable state transition of its toggle latch T3OTL.
1) Exception: Timer T4 is not connected to pins.
Data Sheet
48
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
T3CON.BPS1
fGPT
2 :1
n
Basic Clock Aux. Timer T2 Interrupt Request (T2IRQ)
T2IN T2EUD
U/D T2 Mode Reload Control Capture
Interrupt Request (T3IRQ) T3 Mode Control
T3IN T3EUD
Core Timer T3 U/D
T3OTL Toggle Latch
T3OUT
Capture T4IN T4EUD T4 Mode Control Reload Aux. Timer T4 U/D Interrupt Request (T4IRQ)
MC_GPT_BLOCK1
Figure 7
Block Diagram of GPT1
Data Sheet
49
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description With its maximum resolution of 2 system clock cycles, the GPT2 module provides precise event control and time measurement. It includes two timers (T5, T6) and a capture/reload register (CAPREL). Both timers can be clocked with an input clock which is derived from the CPU clock via a programmable prescaler or with external signals. The counting direction (up/down) for each timer can be programmed by software or altered dynamically with an external signal on a port pin (TxEUD1)). Concatenation of the timers is supported with the output toggle latch (T6OTL) of timer T6, which changes its state on each timer overflow/underflow. The state of this latch may be used to clock timer T5, and/or it may be output on pin T6OUT. The overflows/underflows of timer T6 can also be used to clock the CAPCOM2 timers and to initiate a reload from the CAPREL register. The CAPREL register can capture the contents of timer T5 based on an external signal transition on the corresponding port pin (CAPIN); timer T5 may optionally be cleared after the capture procedure. This allows the XC2365 to measure absolute time differences or to perform pulse multiplication without software overhead. The capture trigger (timer T5 to CAPREL) can also be generated upon transitions of GPT1 timer T3 inputs T3IN and/or T3EUD. This is especially advantageous when T3 operates in Incremental Interface Mode.
1) Exception: T5EUD is not connected to a pin.
Data Sheet
50
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
T6CON.BPS2
fGPT
2n:1
Basic Clock GPT2 Timer T5 Interrupt Request (T5IRQ)
T5IN T5EUD
T5 Mode Control
U/D Clear
Capture
CAPIN T3IN/ T3EUD
CAPREL Mode Control
GPT2 CAPREL Reload Clear
Interrupt Request (CRIRQ) Interrupt Request (T6IRQ) Toggle FF
T6IN T6EUD
T6 Mode Control
GPT2 Timer T6 U/D
T6OTL
T6OUT T6OUF
MC_GPT_BLOCK2
Figure 8
Block Diagram of GPT2
Data Sheet
51
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.9
Real Time Clock
The Real Time Clock (RTC) module of the XC2365 can be clocked with a clock signal selected from internal sources or external sources (pins). The RTC basically consists of a chain of divider blocks: * * * Selectable 32:1 and 8:1 dividers (on - off) The reloadable 16-bit timer T14 The 32-bit RTC timer block (accessible via registers RTCH and RTCL) consisting of: - a reloadable 10-bit timer - a reloadable 6-bit timer - a reloadable 6-bit timer - a reloadable 10-bit timer
All timers count up. Each timer can generate an interrupt request. All requests are combined to a common node request.
fRTC
RUN
M UX
:32
M UX
:8
Interrupt Sub Node CNT INT0 CNT INT1 CNT INT2
RTCINT CNT INT3
PRE
REFCLK
REL-Register T14REL 10 Bits 6 Bits 6 Bits 10 Bits
f CNT
T14 T14-Register
10 Bits
6 Bits
6 Bits
10 Bits
CNT-Register
M CB05568B
Figure 9
RTC Block Diagram
Note: The registers associated with the RTC are only affected by a power reset.
Data Sheet
52
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description The RTC module can be used for different purposes: * * * * System clock to determine the current time and date Cyclic time-based interrupt, to provide a system time tick independent of CPU frequency and other resources 48-bit timer for long-term measurements Alarm interrupt at a defined time
Data Sheet
53
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.10
A/D Converters
For analog signal measurement, up to two 10-bit A/D converters (ADC0, ADC1) with 11 + 5 multiplexed input channels and a sample and hold circuit have been integrated on-chip. They use the successive approximation method. The sample time (to charge the capacitors) and the conversion time are programmable so that they can be adjusted to the external circuit. The A/D converters can also operate in 8-bit conversion mode, further reducing the conversion time. Several independent conversion result registers, selectable interrupt requests, and highly flexible conversion sequences provide a high degree of programmability to meet the application requirements. Both modules can be synchronized to allow parallel sampling of two input channels. For applications that require more analog input channels, external analog multiplexers can be controlled automatically. For applications that require fewer analog input channels, the remaining channel inputs can be used as digital input port pins. The A/D converters of the XC2365 support two types of request sources which can be triggered by several internal and external events. * * Parallel requests are activated at the same time and then executed in a predefined sequence. Queued requests are executed in a user-defined sequence.
In addition, the conversion of a specific channel can be inserted into a running sequence without disturbing that sequence. All requests are arbitrated according to the priority level assigned to them. Data reduction features, such as limit checking or result accumulation, reduce the number of required CPU access operations allowing the precise evaluation of analoginputs (high conversion rate) even at a low CPU speed. The Peripheral Event Controller (PEC) can be used to control the A/D converters or to automatically store conversion results to a table in memory for later evaluation, without requiring the overhead of entering and exiting interrupt routines for each data transfer. Each A/D converter contains eight result registers which can be concatenated to build a result FIFO. Wait-for-read mode can be enabled for each result register to prevent the loss of conversion data. In order to decouple analog inputs from digital noise and to avoid input trigger noise, those pins used for analog input can be disconnected from the digital input stages under software control. This can be selected for each pin separately with registers P5_DIDIS and P15_DIDIS (Port x Digital Input Disable). The Auto-Power-Down feature of the A/D converters minimizes the power consumption when no conversion is in progress.
Data Sheet
54
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.11
Universal Serial Interface Channel Modules (USIC)
The XC2365 includes three USIC modules (USIC0, USIC1, USIC2), each providing two serial communication channels. The Universal Serial Interface Channel (USIC) module is based on a generic data shift and data storage structure which is identical for all supported serial communication protocols. Each channel supports complete full-duplex operation with a basic data buffer structure (one transmit buffer and two receive buffer stages). In addition, the data handling software can use FIFOs. The protocol part (generation of shift clock/data/control signals) is independent of the general part and is handled by protocol-specific preprocessors (PPPs). The USIC's input/output lines are connected to pins by a pin routing unit. The inputs and outputs of each USIC channel can be assigned to different interface pins, providing great flexibility to the application software. All assignments can be made during runtime.
Bus Buffer & Shift Structure Protocol Preprocessors Control 0 PPP_A Pin Routing Shell
USIC_basic.vsd
Pins
Bus Interface
DBU 0
DSU 0
PPP_B PPP_C PPP_D
Control 1 PPP_A DBU 1 DSU 1 PPP_B PPP_C PPP_D
fsys
Fractional Dividers
Baud rate Generators
Figure 10 * * *
General Structure of a USIC Module
The regular structure of the USIC module brings the following advantages: Higher flexibility through configuration with same look-and-feel for data management Reduced complexity for low-level drivers serving different protocols Wide range of protocols with improved performances (baud rate, buffer handling)
55 V2.1, 2008-08
Data Sheet
XC2365 XC2000 Family Derivatives
Functional Description Target Protocols Each USIC channel can receive and transmit data frames with a selectable data word width from 1 to 16 bits in each of the following protocols: * UART (asynchronous serial channel) - maximum baud rate: fSYS / 4 - data frame length programmable from 1 to 63 bits - MSB or LSB first LIN Support (Local Interconnect Network) - maximum baud rate: fSYS / 16 - checksum generation under software control - baud rate detection possible by built-in capture event of baud rate generator SSC/SPI/QSPI (synchronous serial channel with or without data buffer) - maximum baud rate in slave mode: fSYS - maximum baud rate in master mode: fSYS / 2, limited by loop delay - number of data bits programmable from 1 to 63, more with explicit stop condition - MSB or LSB first - optional control of slave select signals IIC (Inter-IC Bus) - supports baud rates of 100 kbit/s and 400 kbit/s IIS (Inter-IC Sound Bus) - maximum baud rate: fSYS / 2 for transmitter, fSYS for receiver
*
*
* *
Note: Depending on the selected functions (such as digital filters, input synchronization stages, sample point adjustment, etc.), the maximum achievable baud rate can be limited. Please note that there may be additional delays, such as internal or external propagation delays and driver delays (e.g. for collision detection in UART mode, for IIC, etc.).
Data Sheet
56
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.12
MultiCAN Module
The MultiCAN module contains three independently operating CAN nodes with Full-CAN functionality which are able to exchange Data and Remote Frames using a gateway function. Transmission and reception of CAN frames is handled in accordance with CAN specification V2.0 B (active). Each CAN node can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. All CAN nodes share a common set of 64 message objects. Each message object can be individually allocated to one of the CAN nodes. Besides serving as a storage container for incoming and outgoing frames, message objects can be combined to build gateways between the CAN nodes or to set up a FIFO buffer. The message objects are organized in double-chained linked lists, where each CAN node has its own list of message objects. A CAN node stores frames only into message objects that are allocated to its own message object list and it transmits only messages belonging to this message object list. A powerful, command-driven list controller performs all message object list operations.
MultiCAN Module Kernel
Clock Control fCAN CAN Node 2
TXDC2 RXDC2
Address Decoder
Message Object Buffer
Linked List Control
CAN Node 1
TXDC1 RXDC1
Port Control
CAN Node 0 Interrupt Control CAN Control
TXDC0 RXDC0
mc_multican_block3.vsd
Figure 11
Block Diagram of MultiCAN Module
Data Sheet
57
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description MultiCAN Features * * * * * * * CAN functionality conforming to CAN specification V2.0 B active for each CAN node (compliant to ISO 11898) Three independent CAN nodes 64 independent message objects (shared by the CAN nodes) Dedicated control registers for each CAN node Data transfer rate up to 1 Mbit/s, individually programmable for each node Flexible and powerful message transfer control and error handling capabilities Full-CAN functionality for message objects: - Can be assigned to one of the CAN nodes - Configurable as transmit or receive objects, or as message buffer FIFO - Handle 11-bit or 29-bit identifiers with programmable acceptance mask for filtering - Remote Monitoring Mode, and frame counter for monitoring Automatic Gateway Mode support 16 individually programmable interrupt nodes Analyzer mode for CAN bus monitoring
* * *
Data Sheet
58
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.13
Watchdog Timer
The Watchdog Timer is one of the fail-safe mechanisms which have been implemented to prevent the controller from malfunctioning for longer periods of time. The Watchdog Timer is always enabled after an application reset of the chip. It can be disabled and enabled at any time by executing the instructions DISWDT and ENWDT respectively. The software has to service the Watchdog Timer before it overflows. If this is not the case because of a hardware or software failure, the Watchdog Timer overflows, generating a prewarning interrupt and then a reset request. The Watchdog Timer is a 16-bit timer clocked with the system clock divided by 16,384 or 256. The Watchdog Timer register is set to a prespecified reload value (stored in WDTREL) in order to allow further variation of the monitored time interval. Each time it is serviced by the application software, the Watchdog Timer is reloaded and the prescaler is cleared. Time intervals between 3.2 s and 13.4 s can be monitored (@ 80 MHz). The default Watchdog Timer interval after power-up is 6.5 ms (@ 10 MHz).
3.14
Clock Generation
The Clock Generation Unit can generate the system clock signal fSYS for the XC2365 from a number of external or internal clock sources: * * * * External clock signals with pad or core voltage levels External crystal using the on-chip oscillator On-chip clock source for operation without crystal Wake-up clock (ultra-low-power) to further reduce power consumption
The programmable on-chip PLL with multiple prescalers generates a clock signal for maximum system performance from standard crystals or from the on-chip clock source. See also Section 4.6.2. The Oscillator Watchdog (OWD) generates an interrupt if the crystal oscillator frequency falls below a certain limit or stops completely. In this case, the system can be supplied with an emergency clock to enable operation even after an external clock failure. All available clock signals can be output on one of two selectable pins.
Data Sheet
59
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.15
Parallel Ports
The XC2365 provides up to 75 I/O lines which are organized into 7 input/output ports and 2 input ports. All port lines are bit-addressable, and all input/output lines can be individually (bit-wise) configured via port control registers. This configuration selects the direction (input/output), push/pull or open-drain operation, activation of pull devices, and edge characteristics (shape) and driver characteristics (output current) of the port drivers. The I/O ports are true bidirectional ports which are switched to high impedance state when configured as inputs. During the internal reset, all port pins are configured as inputs without pull devices active. All port lines have alternate input or output functions associated with them. These alternate functions can be programmed to be assigned to various port pins to support the best utilization for a given application. For this reason, certain functions appear several times in Table 9. All port lines that are not used for alternate functions may be used as general purpose I/O lines. Table 9 Port Port 0 Summary of the XC2365's Parallel Ports Width 8 Alternate Functions Address lines, Serial interface lines of USIC1, CAN0, and CAN1, Input/Output lines for CCU61 Address lines, Serial interface lines of USIC1 and USIC2, OCDS control, interrupts Address and/or data lines, bus control, Serial interface lines of USIC0, CAN0, and CAN1, Input/Output lines for CCU60 and CAPCOM2, Timer control signals, JTAG, interrupts, system clock output Chip select signals, Serial interface lines of CAN2, Input/Output lines for CAPCOM2, Timer control signals Analog input channels to ADC0, Input/Output lines for CCU6x, Timer control signals, JTAG, OCDS control, interrupts
Port 1
8
Port 2
13
Port 4
8
Port 5
16
Data Sheet
60
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description Table 9 Port Port 6 Summary of the XC2365's Parallel Ports (cont'd) Width 4 Alternate Functions ADC control lines, Serial interface lines of USIC1, Timer control signals, OCDS control ADC control lines, Serial interface lines of USIC0, Timer control signals, JTAG, OCDS control,system clock output Address and/or data lines, bus control, Serial interface lines of USIC0, USIC1, and CAN2, Input/Output lines for CCU60, JTAG, OCDS control Analog input channels to ADC1, Timer control signals
Port 7
5
Port 10
16
Port 15
8
Data Sheet
61
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description
3.16
Instruction Set Summary
Table 10 lists the instructions of the XC2365. The addressing modes that can be used with a specific instruction, the function of the instructions, parameters for conditional execution of instructions, and the opcodes for each instruction can be found in the "Instruction Set Manual". This document also provides a detailed description of each instruction. Table 10 Mnemonic ADD(B) ADDC(B) SUB(B) SUBC(B) MUL(U) DIV(U) DIVL(U) CPL(B) NEG(B) AND(B) OR(B) XOR(B) BCLR/BSET BMOV(N) BCMP BFLDH/BFLDL CMP(B) CMPD1/2 CMPI1/2 PRIOR SHL/SHR Instruction Set Summary Description Add word (byte) operands Add word (byte) operands with Carry Subtract word (byte) operands Subtract word (byte) operands with Carry (Un)Signed multiply direct GPR by direct GPR (16- x 16-bit) Bytes 2/4 2/4 2/4 2/4 2
(Un)Signed divide register MDL by direct GPR (16-/16-bit) 2 (Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2 Complement direct word (byte) GPR Negate direct word (byte) GPR Bitwise AND, (word/byte operands) Bitwise OR, (word/byte operands) Bitwise exclusive OR, (word/byte operands) Clear/Set direct bit Move (negated) direct bit to direct bit Compare direct bit to direct bit Bitwise modify masked high/low byte of bit-addressable direct word memory with immediate data Compare word (byte) operands Compare word data to GPR and decrement GPR by 1/2 Compare word data to GPR and increment GPR by 1/2 Determine number of shift cycles to normalize direct word GPR and store result in direct word GPR Shift left/right direct word GPR 2 2 2/4 2/4 2/4 2 4 4 4 4 2/4 2/4 2/4 2 2
BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit
Data Sheet
62
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Functional Description Table 10 Mnemonic ROL/ROR ASHR MOV(B) MOVBS/Z JMPA/I/R JMPS JB(C) JNB(S) CALLA/I/R CALLS PCALL TRAP PUSH/POP SCXT RET(P) RETS RETI SBRK SRST IDLE PWRDN SRVWDT DISWDT/ENWDT EINIT ATOMIC EXTR EXTP(R) EXTS(R)
Data Sheet
Instruction Set Summary (cont'd) Description Rotate left/right direct word GPR Arithmetic (sign bit) shift right direct word GPR Move word (byte) data Move byte operand to word op. with sign/zero extension Jump absolute/indirect/relative if condition is met Jump absolute to a code segment Jump relative if direct bit is set (and clear bit) Jump relative if direct bit is not set (and set bit) Call absolute subroutine in any code segment Push direct word register onto system stack and call absolute subroutine Call interrupt service routine via immediate trap number Push/pop direct word register onto/from system stack Push direct word register onto system stack and update register with word operand Return from intra-segment subroutine (and pop direct word register from system stack) Return from inter-segment subroutine Return from interrupt service subroutine Software Break Software Reset Enter Idle Mode Unused instruction1) Service Watchdog Timer Disable/Enable Watchdog Timer End-of-Initialization Register Lock Begin ATOMIC sequence Begin EXTended Register sequence Begin EXTended Page (and Register) sequence Begin EXTended Segment (and Register) sequence
63
Bytes 2 2 2/4 2/4 4 4 4 4 4 4 2 2 4 2 2 2 2 4 4 4 4 4 4 2 2 2/4 2/4
V2.1, 2008-08
Call absolute/indirect/relative subroutine if condition is met 4
XC2365 XC2000 Family Derivatives
Functional Description Table 10 Mnemonic NOP CoMUL/CoMAC CoADD/CoSUB Co(A)SHR CoSHL CoLOAD/STORE CoCMP CoMAX/MIN CoABS/CoRND CoMOV CoNEG/NOP Instruction Set Summary (cont'd) Description Null operation Multiply (and accumulate) Add/Subtract (Arithmetic) Shift right Shift left Load accumulator/Store MAC register Compare Maximum/Minimum Absolute value/Round accumulator Data move Negate accumulator/Null operation Bytes 2 4 4 4 4 4 4 4 4 4 4
1) The Enter Power Down Mode instruction is not used in the XC2365, due to the enhanced power control scheme. PWRDN will be correctly decoded, but will trigger no action.
Data Sheet
64
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4
Electrical Parameters
The operating range for the XC2365 is defined by its electrical parameters. For proper operation the specified limits must be respected during system design. Note: Typical parameter values refer to room temperature and nominal supply voltage, minimum/maximum parameter values also include conditions of minimum/maximum temperature and minimum/maximum supply voltage. Additional details are described where applicable.
4.1
General Parameters
These parameters are valid for all subsequent descriptions, unless otherwise noted. Table 11 Parameter Storage temperature Absolute Maximum Rating Parameters Symbol Min. -65 -40 -0.5 -0.5 -0.5 -10 - Values Typ. - - - - - - - Max. 150 150 1.65 6.0 Unit Note / Test Condition C C V V V mA mA - under bias - -
TST Junction temperature TJ Voltage on VDDI pins with VDDIM, VDDI1 respect to ground (VSS) Voltage on VDDP pins with VDDPA, respect to ground (VSS) VDDPB Voltage on any pin with VIN
respect to ground (VSS) Input current on any pin during overload condition Absolute sum of all input currents during overload condition Output current on any pin - -
VDDP
10
+ 0.5
VIN < VDDPmax
- -
|100|
IOH, IOL
-
-
|30|
mA
-
Note: Stresses above the values listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for an extended time may affect device reliability. During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the voltage on VDDP pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings.
Data Sheet
65
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Operating Conditions The following operating conditions must not be exceeded to ensure correct operation of the XC2365. All parameters specified in the following sections refer to these operating conditions, unless otherwise noticed. Table 12 Parameter Operating Condition Parameters Symbol Min. Digital core supply voltage VDDI Core Supply Voltage Difference Digital supply voltage for IO pads and voltage regulators, upper voltage range Digital supply voltage for IO pads and voltage regulators, lower voltage range Digital ground voltage Overload current VDDI 1.4 -10 4.5 Values Typ. - - - Max. 1.6 +10 5.5 Unit Note / Test Condition V mV V
VDDIM - VDDI1
1) 2)
VDDPA, VDDPB VDDPA, VDDPB VSS IOV
3.0
-
4.5
V
2)
0 -5 -2
- - - 1.0 x 10-6 2.5 x 10-4 1.0 x 10-4 1.0 x 10-2 -
0 5 5 1.0 x 10-4 1.5 x 10-3 5.0 x 10-3 3.0 x 10-2 50
V mA mA -
Reference voltage Per IO pin3)4) Per analog input pin3)4)
Overload positive current coupling factor for analog inputs5)
KOVA
-
IOV > 0 IOV < 0 IOV > 0 IOV < 0
4)
Overload negative current KOVA coupling factor for analog inputs5) Overload positive current coupling factor for digital I/O pins5)
-
-
KOVD
-
-
Overload negative current KOVD coupling factor for digital I/O pins5) Absolute sum of overload currents
Data Sheet
-
-
|IOV|
-
mA
66
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 12 Parameter External Pin Load Capacitance Voltage Regulator Buffer Capacitance for DMP_M Voltage Regulator Buffer Capacitance for DMP_1 Operating frequency Ambient temperature Operating Condition Parameters (cont'd) Symbol Min. Values Typ. 20 - - - - Max. - 4.7 2.2 80 - - 1.0 0.47 - - Unit Note / Test Condition pF F F MHz C Pin drivers in default mode6)
7)
CL CEVRM CEVR1 fSYS TA
One for each supply pin7)
8)
See Table 1
1) If both core power domains are clocked, the difference between the power supply voltages must be less than 10 mV. This condition imposes additional constraints when using external power supplies. Do not combine internal and external supply of different core power domains. Do not supply the core power domains with two independent external voltage regulators. The simplest method is to supply both power domains directly via a single external power supply. 2) Performance of pad drivers, A/D Converter, and Flash module depends on VDDP. If the external supply voltage VDDP becomes lower than the specified operating range, a power reset must be generated. Otherwise, the core supply voltage VDDI may rise above its specified operating range due to parasitic effects. This power reset can be generated by the on-chip SWD. If the SWD is disabled the power reset must be generated by activating the PORST input. 3) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin exceeds the specified range: VOV > VIHmax (IOV > 0) or VOV < VILmin (IOV < 0). The absolute sum of input overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified limits. Proper operation under overload conditions depends on the application. Overload conditions must not occur on pin XTAL1 (powered by VDDI). 4) Not subject to production test - verified by design/characterization. 5) An overload current (IOV) through a pin injects an error current (IINJ) into the adjacent pins. This error current adds to that pin's leakage current (IOZ). The value of the error current depends on the overload current and is defined by the overload coupling factor KOV. The polarity of the injected error current is reversed from the polarity of the overload current that produces it. The total current through a pin is |ITOT| = |IOZ| + (|IOV| x KOV). The additional error current may distort the input voltage on analog inputs. 6) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output current may lead to increased delays or reduced driving capability (CL). 7) To ensure the stability of the voltage regulators the EVRs must be buffered with ceramic capacitors. Separate buffer capacitors with the recomended values shall be connected as close as possible to each VDDI pin to keep the resistance of the board tracks below 2 . Connect all VDDI1 pins together. The minimum capacitance value is required for proper operation under all conditions (e.g. temperature). Higher values slightly increase the startup time. 8) The operating frequency range may be reduced for specific types of the device designation (...FxxL). 80-MHz devices are marked ...F80L.
XC2365. This is indicated in the
Data Sheet
67
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Parameter Interpretation The parameters listed in the following include both the characteristics of the XC2365 and its demands on the system. To aid in correctly interpreting the parameters when evaluating them for a design, they are marked accordingly in the column "Symbol": CC (Controller Characteristics): The logic of the XC2365 provides signals with the specified characteristics. SR (System Requirement): The external system must provide signals with the specified characteristics to the XC2365.
Data Sheet
68
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.2
DC Parameters
These parameters are static or average values that may be exceeded during switching transitions (e.g. output current). The XC2365 can operate within a wide supply voltage range from 3.0 V to 5.5 V. However, during operation this supply voltage must remain within 10 percent of the selected nominal supply voltage. It cannot vary across the full operating voltage range. Because of the supply voltage restriction and because electrical behavior depends on the supply voltage, the parameters are specified separately for the upper and the lower voltage range. During operation, the supply voltages may only change with a maximum speed of dV/dt < 1 V/ms. Leakage current is strongly dependent on the operating temperature and the voltage level at the respective pin. The maximum values in the following tables apply under worst case conditions, i.e. maximum temperature and an input level equal to the supply voltage. The value for the leakage current in an application can be determined by using the respective leakage derating formula (see tables) with values from that application. The pads of the XC2365 are designed to operate in various driver modes. The DC parameter specifications refer to the current limits in Table 13. Table 13 Current Limits for Port Output Drivers Maximum Output Current (IOLmax, -IOHmax)1) Nominal Output Current (IOLnom, -IOHnom)
Port Output Driver Mode Strong driver Medium driver Weak driver
VDDP 4.5 V
10 mA 4.0 mA 0.5 mA
VDDP < 4.5 V
10 mA 2.5 mA 0.5 mA
VDDP 4.5 V
2.5 mA 1.0 mA 0.1 mA
VDDP < 4.5 V
2.5 mA 1.0 mA 0.1 mA
1) An output current above |IOXnom| may be drawn from up to three pins at the same time. For any group of 16 neighboring output pins, the total output current in each direction (IOL and -IOH) must remain below 50 mA.
Data Sheet
69
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Pullup/Pulldown Device Behavior Most pins of the XC2365 feature pullup or pulldown devices. For some special pins these are fixed; for the port pins they can be selected by the application. The specified current values indicate how to load the respective pin depending on the intended signal level. Figure 12 shows the current paths. The shaded resistors shown in the figure may be required to compensate system pull currents that do not match the given limit values.
VDDP
Pullup
Pulldown
VSS
MC_XC2X_PULL
Figure 12
Pullup/Pulldown Current Definition
Data Sheet
70
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.2.1
DC Parameters for Upper Voltage Area
These parameters apply to the upper IO voltage range, 4.5 V VDDP 5.5 V. Table 14 Parameter Input low voltage (all except XTAL1) Input high voltage (all except XTAL1) Input Hysteresis2) DC Characteristics for Upper Voltage Range (Operating Conditions apply)1) Symbol Min. Values Typ. - - Max. 0.3 x -0.3 0.7 x Unit Note / Test Condition V V V - -
VIL SR VIH SR
VDDP
VDDP VDDP
-
+ 0.3
HYS CC 0.11 - x VDDP
VDDP in [V],
Series resistance = 0 1.0 0.4 - - 200 5 V V V V nA A
Output low voltage Output low voltage Output high voltage
5)
VOL CC - VOL CC - VOH CC VDDP
- 1.0 - 0.4
- - - - 10 0.2
IOL IOLmax3) IOL IOLnom3)4) IOH IOHmax3) IOH IOHnom3)4)
0 V < VIN < VDDP
Output high voltage5) Input leakage current (Port 5, Port 15)6) Input leakage current (all other)6)7) Input leakage current (all other)6)7) Pull level keep current Pull level force current Pin capacitance9) (digital inputs/outputs)
VOH CC VDDP IOZ1 CC - IOZ2 CC - IOZ2 CC - IPLK IPLF CIO CC
0.2
15
A
- 250 -
- - -
30 - 10
A A pF
TJ 110C, 0.45 V < VIN < VDDP TJ 150C, 0.45 V < VIN < VDDP VPIN VIH (up)8) VPIN VIL (dn) VPIN VIL (up)8) VPIN VIH (dn)
1) Keeping signal levels within the limits specified in this table ensures operation without overload conditions. For signal levels outside these specifications, also refer to the specification of the overload current IOV.
Data Sheet
71
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It cannot suppress switching due to external system noise under all conditions. 3) The maximum deliverable output current of a port driver depends on the selected output driver mode, see Table 13, Current Limits for Port Output Drivers. The limit for pin groups must be respected. 4) As a rule, with decreasing output current the output levels approach the respective supply level (VOLVSS, VOHVDDP). However, only the levels for nominal output currents are verified. 5) This specification is not valid for outputs which are switched to open drain mode. In this case the respective output will float and the voltage is determined by the external circuit. 6) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to the definition of the overload coupling factor KOV. 7) The given values are worst-case values. In production test, this leakage current is only tested at 125C; other values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating depending on temperature (TJ = junction temperature [C]): IOZ = 0.05 x e(1.5 + 0.028xTJ) [A]. For example, at a temperature of 130C the resulting leakage current is 8.54 A. Leakage derating depending on voltage level (DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) [A] This voltage derating formula is an approximation which applies for maximum temperature. Because pin P2.8 is connected to two pads (standard pad and high-speed clock pad), it has twice the normal leakage. 8) Keep current: Limit the current through this pin to the indicated value so that the enabled pull device can keep the default pin level: VPIN VIH for a pullup; VPIN VIL for a pulldown. Force current: Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull device: VPIN VIL for a pullup; VPIN VIH for a pulldown. These values apply to the fixed pull-devices in dedicated pins and to the user-selectable pull-devices in general purpose IO pins. 9) Not subject to production test - verified by design/characterization. Because pin P2.8 is connected to two pads (standard pad and high-speed clock pad), it has twice the normal capacitance.
Data Sheet
72
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.2.2
DC Parameters for Lower Voltage Area
These parameters apply to the lower IO voltage range, 3.0 V VDDP 4.5 V. Table 15 Parameter Input low voltage (all except XTAL1) Input high voltage (all except XTAL1) Input Hysteresis2) DC Characteristics for Lower Voltage Range (Operating Conditions apply)1) Symbol Min. Values Typ. - - Max. 0.3 x -0.3 0.7 x Unit Note / Test Condition V V V - -
VIL SR VIH SR
VDDP
VDDP VDDP
-
+ 0.3
HYS CC 0.07 - x VDDP
VDDP in [V],
Series resistance = 0 1.0 0.4 - - 200 2.5 V V V V nA A
Output low voltage Output low voltage Output high voltage
5)
VOL CC - VOL CC - VOH CC VDDP
- 1.0 - 0.4
- - - - 10 0.2
IOL IOLmax3) IOL IOLnom3)4) IOH IOHmax3) IOH IOHnom3)4)
0 V < VIN < VDDP
Output high voltage5) Input leakage current (Port 5, Port 15)6) Input leakage current (all other)6)7) Input leakage current (all other)6)7) Pull level keep current Pull level force current Pin capacitance9) (digital inputs/outputs)
VOH CC VDDP IOZ1 CC - IOZ2 CC - IOZ2 CC - IPLK IPLF CIO CC
0.2
8
A
- 150 -
- - -
10 - 10
A A pF
TJ 110C, 0.45 V < VIN < VDDP TJ 150C, 0.45 V < VIN < VDDP VPIN VIH (up)8) VPIN VIL (dn) VPIN VIL (up)8) VPIN VIH (dn)
1) Keeping signal levels within the limits specified in this table ensures operation without overload conditions. For signal levels outside these specifications, also refer to the specification of the overload current IOV.
Data Sheet
73
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It cannot suppress switching due to external system noise under all conditions. 3) The maximum deliverable output current of a port driver depends on the selected output driver mode, see Table 13, Current Limits for Port Output Drivers. The limit for pin groups must be respected. 4) As a rule, with decreasing output current the output levels approach the respective supply level (VOLVSS, VOHVDDP). However, only the levels for nominal output currents are verified. 5) This specification is not valid for outputs which are switched to open drain mode. In this case the respective output will float and the voltage is determined by the external circuit. 6) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to the definition of the overload coupling factor KOV. The leakage current value is not tested in the lower voltage range but only in the upper voltage range. This parameter is ensured by correlation. 7) The given values are worst-case values. In production test, this leakage current is only tested at 125C; other values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating depending on temperature (TJ = junction temperature [C]): IOZ = 0.03 x e(1.35 + 0.028xTJ) [A]. For example, at a temperature of 130C the resulting leakage current is 4.41 A. Leakage derating depending on voltage level (DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.3 x DV) [A] This voltage derating formula is an approximation which applies for maximum temperature. Because pin P2.8 is connected to two pads (standard pad and high-speed clock pad), it has twice the normal leakage. 8) Keep current: Limit the current through this pin to the indicated value so that the enabled pull device can keep the default pin level: VPIN VIH for a pullup; VPIN VIL for a pulldown. Force current: Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull device: VPIN VIL for a pullup; VPIN VIH for a pulldown. These values apply to the fixed pull-devices in dedicated pins and to the user-selectable pull-devices in general purpose IO pins. 9) Not subject to production test - verified by design/characterization. Because pin P2.8 is connected to two pads (standard pad and high-speed clock pad), it has twice the normal capacitance.
Data Sheet
74
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.2.3
Power Consumption
The power consumed by the XC2365 depends on several factors such as supply voltage, operating frequency, active circuits, and operating temperature. The power consumption specified here consists of two components: * * The switching current IS depends on the device activity The leakage current ILK depends on the device temperature
To determine the actual power consumption, always both components, switching current IS (Table 16) and leakage current ILK (Table 17) must be added:
IDDP = IS + ILK.
Note: The power consumption values are not subject to production test. They are verified by design/characterization. To determine the total power consumption for dimensioning the external power supply, also the pad driver currents must be considered. The given power consumption parameters and their values refer to specific operating conditions: * * Active mode: Regular operation, i.e. peripherals are active, code execution out of Flash. Stopover mode: Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1 stopped.
Note: The maximum values cover the complete specified operating range of all manufactured devices. The typical values refer to average devices under typical conditions, such as nominal supply voltage, room temperature, application-oriented activity. After a power reset, the decoupling capacitors for VDDI are charged with the maximum possible current, see parameter ICC in Table 20. For additional information, please refer to Section 5.2, Thermal Considerations.
Data Sheet
75
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 16 Parameter Switching Power Consumption XC2365 (Operating Conditions apply) SymValues bol Min. Typ. Max. - Unit Note / Test Condition Active mode1)2) fSYS in [MHz] Stopover Mode2)
Power supply current ISACT (active) with all peripherals active and EVVRs on Power supply current in stopover mode, EVVRs on
10 + 10 + mA 0.6xfSYS 1.0xfSYS 1.0 2.0 mA
ISSO
-
1) The pad supply voltage pins (VDDPB) provide the input current for the on-chip EVVRs and the current consumed by the pin output drivers. A small current is consumed because the drivers' input stages are switched. 2) The pad supply voltage has only a minor influence on this parameter.
Data Sheet
76
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
IS [mA]
100 90 80 70
ISACTmax
ISACTtyp
60 50 40 30 20 10
20
Figure 13
40
60
80
fSYS [MHz]
MC_XC2XM_IS
Supply Current in Active Mode as a Function of Frequency
Data Sheet
77
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 17 Parameter Leakage Power Consumption XC2365 (Operating Conditions apply) Symbol Min. - - - - Values Typ. 0.03 0.5 2.1 4.4 Max. 0.05 1.3 6.2 13.7 Unit Note / Test Condition1) mA mA mA mA
ILK1 Leakage supply current2) 3) - Formula : 600,000 x e ; = 5000 / (273 + BxTJ); Typ.: B = 1.0, Max.: B = 1.3
TJ = 25C TJ = 85C TJ = 125C TJ = 150C
1) All inputs (including pins configured as inputs) are set at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP and all outputs (including pins configured as outputs) are disconnected. 2) The supply current caused by leakage depends mainly on the junction temperature (see Figure 14) and the supply voltage. The temperature difference between the junction temperature TJ and the ambient temperature TA must be taken into account. As this fraction of the supply current does not depend on device activity, it must be added to other power consumption values. 3) This formula is valid for temperatures above 0C. For temperatures below 0C a value of below 10 A can be assumed.
ILK [mA]
14 12 10 8 6 4 2
ILK1max
ILK1typ
-50
0
50
100
150
TJ [C]
MC_XC2X_ILK150N
Figure 14
Leakage Supply Current as a Function of Temperature
Data Sheet
78
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.3
Analog/Digital Converter Parameters
These parameters describe the conditions for optimum ADC performance. Table 18 Parameter Analog reference supply Analog reference ground Analog input voltage range Analog clock frequency result
4)
A/D Converter Characteristics (Operating Conditions apply) Symbol Min. Limit Values Max. SR VAGND + 1.0 SR VSS - 0.05 SR VAGND 0.5 Unit Test Condition V V V MHz - - s s
1)
VAREF VAGND VAIN
VDDPA VAREF
- 1.0
+ 0.05 -
2)
VAREF
20
fADCI Conversion time for 10-bit tC10
Conversion time for 8-bit result4)
3)
CC (13 + STC) x tADCI + 2 x tSYS CC (11 + STC) x tADCI + 2 x tSYS CC - CC - CC - CC - CC - CC - CC - CC - CC - 1 10 2 1 1.2 0.8 0.8 10 4 1.5 15
- - - -
tC8
Wakeup time from analog tWAF powerdown, fast mode Wakeup time from analog tWAS powerdown, slow mode Total unadjusted error5) DNL error INL error Gain error Offset error Total capacitance of an analog input Switched capacitance of an analog input Resistance of the analog input path Total capacitance of the reference input TUE EADNL EAINL EAOFF
LSB VAREF = 5.0 V1) LSB LSB LSB LSB pF pF k pF
6)7)
EAGAIN CC -
CAINT CAINS RAIN
6)7)
6)7)
CAREFT CC -
6)7)
Data Sheet
79
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 18 Parameter Switched capacitance of the reference input Resistance of the reference input path A/D Converter Characteristics (cont'd) (Operating Conditions apply) Symbol Min. Limit Values Max. 7 2 Unit Test Condition pF k
6)7)
CAREFS CC - RAREF
CC -
6)7)
1) TUE is tested at VAREFx = VDDPA, VAGND = 0 V. It is verified by design for all other voltages within the defined voltage range. The specified TUE is valid only if the absolute sum of input overload currents on Port 5 or Port 15 pins (see IOV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the measurement time. 2) VAIN may exceed VAGND or VAREFx up to the absolute maximum ratings. However, the conversion result in these cases will be X000H or X3FFH, respectively. 3) The limit values for fADCI must not be exceeded when selecting the peripheral frequency and the prescaler setting. 4) This parameter includes the sample time (also the additional sample time specified by STC), the time to determine the digital result and the time to load the result register with the conversion result. Values for the basic clock tADCI depend on programming and are found in Table 19. 5) The total unadjusted error TUE is the maximum deviation from the ideal ADC transfer curve, not the sum of individual errors. All error specifications are based on measurement methods standardized by IEEE 1241.2000. 6) Not subject to production test - verified by design/characterization. 7) These parameter values cover the complete operating range. Under relaxed operating conditions (temperature, supply voltage) typical values can be used for calculation. At room temperature and nominal supply voltage the following typical values can be used: CAINTtyp = 12 pF, CAINStyp = 5 pF, RAINtyp = 1.0 k, CAREFTtyp = 15 pF, CAREFStyp = 10 pF, RAREFtyp = 1.0 k.
RSource V AIN C Ext
R AIN, On C AINT - C AINS
A/D Converter
CAINS
MCS05570
Figure 15
Equivalent Circuitry for Analog Inputs
Data Sheet
80
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Sample time and conversion time of the XC2365's A/D converters are programmable. The timing above can be calculated using Table 19. The limit values for fADCI must not be exceeded when selecting the prescaler value. Table 19 A/D Converter Computation Table A/D Converter Analog Clock fADCI INPCRx.7-0 (STC) 00H 01H 02H : FEH FFH Sample Time
GLOBCTR.5-0 (DIVA) 000000B 000001B 000010B : 111110B 111111B
fSYS fSYS / 2 fSYS / 3 fSYS / (DIVA+1) fSYS / 63 fSYS / 64
tS tADCI x 2 tADCI x 3 tADCI x 4 tADCI x (STC+2) tADCI x 256 tADCI x 257
Converter Timing Example A: Assumptions: Analog clock Sample time
fSYS fADCI tS tC10
= 80 MHz (i.e. tSYS = 12.5 ns), DIVA = 03H, STC = 00H = fSYS / 4 = 20 MHz, i.e. tADCI = 50 ns = tADCI x 2 = 100 ns = 13 x tADCI + 2 x tSYS = 13 x 50 ns + 2 x 12.5 ns = 0.675 s = 11 x tADCI + 2 x tSYS = 11 x 50 ns + 2 x 12.5 ns = 0.575 s
Conversion 10-bit: Conversion 8-bit:
tC8
Converter Timing Example B: Assumptions: Analog clock Sample time
fSYS fADCI tS tC10
= 40 MHz (i.e. tSYS = 25 ns), DIVA = 02H, STC = 03H = fSYS / 3 = 13.3 MHz, i.e. tADCI = 75 ns = tADCI x 5 = 375 ns = 16 x tADCI + 2 x tSYS = 16 x 75 ns + 2 x 25 ns = 1.25 s = 14 x tADCI + 2 x tSYS = 14 x 75 ns + 2 x 25 ns = 1.10 s
Conversion 10-bit: Conversion 8-bit:
tC8
Data Sheet
81
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.4
System Parameters
The following parameters specify several aspects which are important when integrating the XC2365 into an application system. Note: These parameters are not subject to production test but verified by design and/or characterization. Table 20 Parameter Supply watchdog (SWD) supervision level (see Table 21) Various System Parameters Symbol Min. Values Typ. Max. Unit Note / Test Condition V
VSWD
CC
0.150
VLV -
VLV VLV VLV
VLV + VLV + VLV +
0.100 V
VLV = selected VLV = selected VLV = selected
voltage
voltage in upper voltage area voltage in lower voltage area
VLV 0.125
Core voltage (PVC) supervision level (see Table 22) Current control limit
0.050 V
VPVC CC VLV ICC CC
0.070
0.030 mA mA kHz MHz s
13 90
- - 500 5.0 260
30 150 600 5.2 320
Power domain DMP_M Power domain DMP_1 FREQSEL = 00B
Wakeup clock source frequency Internal clock source frequency Startup time from stopover mode
fWU CC fINT CC
400 4.8
tSSO CC 200
User instruction from PSRAM
Data Sheet
82
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 21 Code 0000B 0001B 0010B 0011B 0100B 0101B 0110B 0111B 1000B 1001B 1010B 1011B 1100B 1101B 1110B 1111B Coding of Bitfields LEVxV in Register SWDCON0 Default Voltage Level 2.9 V 3.0 V 3.1 V 3.2 V 3.3 V 3.4 V 3.6 V 4.0 V 4.2 V 4.5 V 4.6 V 4.7 V 4.8 V 4.9 V 5.0 V 5.5 V LEV2V: no request LEV1V: reset request Notes1)
1) The indicated default levels are selected automatically after a power reset.
Table 22 Code 000B 001B 010B 011B 100B 101B 110B 111B
Coding of Bitfields LEVxV in Registers PVCyCONz Default Voltage Level 0.9 V 1.0 V 1.1 V 1.2 V 1.3 V 1.4 V 1.5 V 1.6 V LEV1V: reset request LEV2V: interrupt request Notes1)
1) The indicated default levels are selected automatically after a power reset.
Data Sheet
83
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.5
Flash Memory Parameters
The XC2365 is delivered with all Flash sectors erased and with no protection installed. The data retention time of the XC2365's Flash memory (i.e. the time after which stored data can still be retrieved) depends on the number of times the Flash memory has been erased and programmed. Note: These parameters are not subject to production test but verified by design and/or characterization. Table 23 Parameter Programming time per 128-byte page Erase time per sector/page Data retention time Flash Characteristics (Operating Conditions apply) Symbol Min. Limit Values Typ. 3
1)
Unit ms ms years
Max. 3.5 5 -
Note / Test Condition ms ms 1,000 erase / program cycles
tPR tER tRET
- - 20
41) -
Flash erase endurance for NER user sectors2) Flash erase endurance for NSEC security pages Drain disturb limit
15,000 - 10 64 - -
- - -
cycles Data retention time 5 years cycles Data retention time 20 years cycles
3)
NDD
1) Programming and erase times depend on the internal Flash clock source. The control state machine needs a few system clock cycles. This requirement is only relevant for extremely low system frequencies. In the XC2365 erased areas must be programmed completely (with actual code/data or dummy values) before that area is read. 2) A maximum of 64 Flash sectors can be cycled 15,000 times. For all other sectors the limit is 1,000 cycles. 3) This parameter limits the number of subsequent programming operations within a physical sector. The drain disturb limit is applicable if wordline erase is used repeatedly. For normal sector erase/program cycles this limit will not be violated.
Access to the XC2365 Flash modules is controlled by the IMB. Built-in prefetch mechanisms optimize the performance for sequential access. Flash access waitstates only affect non-sequential access. Due to prefetch mechanisms, the performance for sequential access (depending on the software structure) is only partially influenced by waitstates.
Data Sheet
84
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 24 Flash Access Waitstates System Frequency Range
Required Waitstates 4 WS (WSFLASH = 100B) 3 WS (WSFLASH = 011B) 2 WS (WSFLASH = 010B) 1 WS (WSFLASH = 001B) 0 WS (WSFLASH = 000B)
fSYS fSYSmax fSYS 17 MHz fSYS 13 MHz fSYS 8 MHz
Forbidden! Must not be selected!
Note: The maximum achievable system frequency is limited by the properties of the respective derivative.
Data Sheet
85
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.6
AC Parameters
These parameters describe the dynamic behavior of the XC2365.
4.6.1
Testing Waveforms
These values are used for characterization and production testing (except pin XTAL1).
Output delay Hold time Output delay Hold time
0.8 V DDP 0.7 V DDP Input Signal (driven by tester) 0.3 V DDP 0.2 V DDP
Output Signal (measured)
Output timings refer to the rising edge of CLKOUT. Input timings are calculated from the time, when the input signal reaches V IH or V IL, respectively.
MCD05556C
Figure 16
Input Output Waveforms
VLoad + 0.1 V
Timing Reference Points
V OH - 0.1 V
V Load - 0.1 V
V OL + 0.1 V
For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs, but begins to float when a 100 mV change from the loaded V OH /V OL level occurs (IOH / IOL = 20 mA).
MCA05565
Figure 17
Data Sheet
Floating Waveforms
86 V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.6.2
Definition of Internal Timing
The internal operation of the XC2365 is controlled by the internal system clock fSYS. Because the system clock signal fSYS can be generated from a number of internal and external sources using different mechanisms, the duration of the system clock periods (TCSs) and their variation (as well as the derived external timing) depend on the mechanism used to generate fSYS. This must be considered when calculating the timing for the XC2365.
Phase Locked Loop Operation (1:N)
f IN f SYS
TCS Direct Clock Drive (1:1)
f IN f SYS
TCS Prescaler Operation (N:1)
f IN f SYS
TCS
M C_XC2X_CLOCKGEN
Figure 18
Generation Mechanisms for the System Clock
Note: The example of PLL operation shown in Figure 18 uses a PLL factor of 1:4; the example of prescaler operation uses a divider factor of 2:1. The specification of the external timing (AC Characteristics) depends on the period of the system clock (TCS).
Data Sheet
87
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Direct Drive When direct drive operation is selected (SYSCON0.CLKSEL = 11B), the system clock is derived directly from the input clock signal CLKIN1:
fSYS = fIN.
The frequency of fSYS is the same as the frequency of fIN. In this case the high and low times of fSYS are determined by the duty cycle of the input clock fIN. Selecting Bypass Operation from the XTAL11) input and using a divider factor of 1 results in a similar configuration. Prescaler Operation When prescaler operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 1B), the system clock is derived either from the crystal oscillator (input clock signal XTAL1) or from the internal clock source through the output prescaler K1 (= K1DIV+1):
fSYS = fOSC / K1.
If a divider factor of 1 is selected, the frequency of fSYS equals the frequency of fOSC. In this case the high and low times of fSYS are determined by the duty cycle of the input clock fOSC (external or internal). The lowest system clock frequency results from selecting the maximum value for the divider factor K1:
fSYS = fOSC / 1024.
Phase Locked Loop (PLL) When PLL operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 0B), the on-chip phase locked loop is enabled and provides the system clock. The PLL multiplies the input frequency by the factor F (fSYS = fIN x F). F is calculated from the input divider P (= PDIV+1), the multiplication factor N (= NDIV+1), and the output divider K2 (= K2DIV+1): (F = N / (P x K2)). The input clock can be derived either from an external source at XTAL1 or from the onchip clock source. The PLL circuit synchronizes the system clock to the input clock. This synchronization is performed smoothly so that the system clock frequency does not change abruptly. Adjustment to the input clock continuously changes the frequency of fSYS so that it is locked to fIN. The slight variation causes a jitter of fSYS which in turn affects the duration of individual TCSs.
1) Voltages on XTAL1 must comply to the core supply voltage VDDI1.
Data Sheet
88
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters The timing in the AC Characteristics refers to TCSs. Timing must be calculated using the minimum TCS possible under the given circumstances. The actual minimum value for TCS depends on the jitter of the PLL. Because the PLL is constantly adjusting its output frequency to correspond to the input frequency (from crystal or oscillator), the accumulated jitter is limited. This means that the relative deviation for periods of more than one TCS is lower than for a single TCS (see formulas and Figure 19). This is especially important for bus cycles using waitstates and for the operation of timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter is negligible. The value of the accumulated PLL jitter depends on the number of consecutive VCO output cycles within the respective timeframe. The VCO output clock is divided by the output prescaler K2 to generate the system clock signal fSYS. The number of VCO cycles is K2 x T, where T is the number of consecutive fSYS cycles (TCS). The maximum accumulated jitter (long-term jitter) DTmax is defined by: DTmax [ns] = (220 / (K2 x fSYS) + 4.3) This maximum value is applicable, if either the number of clock cycles T > (fSYS / 1.2) or the prescaler value K2 > 17. In all other cases for a timeframe of T x TCS the accumulated jitter DT is determined by: DT [ns] = DTmax x [(1 - 0.058 x K2) x (T - 1) / (0.83 x fSYS - 1) + 0.058 x K2]
fSYS in [MHz] in all formulas.
Example, for a period of 3 TCSs @ 33 MHz and K2 = 4: Dmax = (220 / (4 x 33) + 4.3) = 5.97 ns (Not applicable directly in this case!) D3 = 5.97 x [(1 - 0.058 x 4) x (3 - 1) / (0.83 x 33 - 1) + 0.058 x 4] = 5.97 x [0.768 x 2 / 26.39 + 0.232] = 1.7 ns Example, for a period of 3 TCSs @ 33 MHz and K2 = 2: Dmax = (220 / (2 x 33) + 4.3) = 7.63 ns (Not applicable directly in this case!) D3 = 7.63 x [(1 - 0.058 x 2) x (3 - 1) / (0.83 x 33 - 1) + 0.058 x 2] = 7.63 x [0.884 x 2 / 26.39 + 0.116] = 1.4 ns
Data Sheet
89
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
Acc. jitter DT ns 9 8 7 6 5 4 3 2 1 0 1 20
fSYS = 33 MHz fSYS = 66 MHz fVCO = 66 MHz f VCO = 132 MHz
Cycles T 40 60 80 100
MC_XC 2X_JITTER
Figure 19
Approximated Accumulated PLL Jitter
Note: The specified PLL jitter values are valid if the capacitive load per pin does not exceed CL = 20 pF (see Table 12). The maximum peak-to-peak noise on the pad supply voltage (measured between VDDPB pin 100/144 and VSS pin 1) is limited to a peak-to-peak voltage of VPP = 50 mV. This can be achieved by appropriate blocking of the supply voltage as close as possible to the supply pins and using PCB supply and ground planes. Different frequency bands can be selected for the VCO so that the operation of the PLL can be adjusted to a wide range of input and output frequencies: Table 25 00 01 1X VCO Bands for PLL Operation1) Base Frequency Range 10 ... 40 MHz 20 ... 80 MHz 50 ... 110 MHz 100 ... 160 MHz Reserved
PLLCON0.VCOSEL VCO Frequency Range
1) Not subject to production test - verified by design/characterization.
Data Sheet
90
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Wakeup Clock When wakeup operation is selected (SYSCON0.CLKSEL = 00B), the system clock is derived from the low-frequency wakeup clock source:
fSYS = fWU.
In this mode, a basic functionality can be maintained without requiring an external clock source and while minimizing the power consumption. Selecting and Changing the Operating Frequency When selecting a clock source and the clock generation method, the required parameters must be carefully written to the respective bitfields, to avoid unintended intermediate states. Many applications change the frequency of the system clock (fSYS) during operation in order to optimize system performance and power consumption. Changing the operating frequency also changes the switching currents, which influences the power supply. To ensure proper operation of the on-chip EVRs while they generate the core voltage, the operating frequency shall only be changed in certain steps. This prevents overshoots and undershoots of the supply voltage. To avoid the indicated problems, recommended sequences are provided which ensure the intended operation of the clock system interacting with the power system. Please refer to the Programmer's Guide.
Data Sheet
91
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.6.3
External Clock Input Parameters
These parameters specify the external clock generation for the XC2365. The clock can be generated in two ways: * * By connecting a crystal or ceramic resonator to pins XTAL1/XTAL2. By supplying an external clock signal. This clock signal can be supplied either to pin XTAL1 (core voltage domain) or to pin CLKIN1 (IO voltage domain).
If connected to CLKIN1, the input signal must reach the defined input levels VIL and VIH. In connected to XTAL1, a minimum amplitude VAX1 (peak-to-peak voltage) is sufficient for the operation of the on-chip oscillator. Note: The given clock timing parameters (t1 ... t4) are only valid for an external clock input signal. Table 26 Parameter Input voltage range limits for signal on XTAL1 Input voltage (amplitude) on XTAL1 XTAL1 input current Oscillator frequency External Clock Input Characteristics (Operating Conditions apply) Symbol Min. Limit Values Typ. - - - - - - - 8 8 Max. 1.7 - 20 40 16 - - 8 8 Unit Note / Test Condition V V A
1)
VIX1 SR -1.7 + VDDI VAX1 SR 0.3 x VDDI IIL CC - fOSC CC 4
4
Peak-to-peak voltage2) 0 V < VIN < VDDI
MHz Clock signal MHz Crystal or Resonator ns ns ns ns
High time Low time Rise time Fall time
t1 SR t2 SR t3 SR t4 SR
6 6 - -
1) Overload conditions must not occur on pin XTAL1. 2) The amplitude voltage VAX1 refers to the offset voltage VOFF. This offset voltage must be stable during the operation and the resulting voltage peaks must remain within the limits defined by VIX1.
Data Sheet
92
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
t1 VOFF t2
t3 VAX1 t4 tOSC = 1/fOSC
MC_EXTCLOCK
Figure 20
External Clock Drive XTAL1
Note: For crystal/resonator operation, it is strongly recommended to measure the oscillation allowance (negative resistance) in the final target system (layout) to determine the optimum parameters for oscillator operation. Please refer to the limits specified by the crystal/resonator supplier.
Data Sheet
93
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.6.4
External Bus Timing
The following parameters specify the behavior of the XC2365 bus interface. Table 27 Parameter CLKOUT cycle time CLKOUT high time CLKOUT low time CLKOUT rise time CLKOUT fall time CLKOUT Reference Signal Symbol Min. Limits Max. 40/25/12.51) - - 3 3 Unit Note / Test Condition ns ns ns ns ns
t5 t6 t7 t8 t9
CC CC 3 CC 3 CC - CC -
1) The CLKOUT cycle time is influenced by the PLL jitter (given values apply to fSYS = 25/40/80 MHz). For longer periods the relative deviation decreases (see PLL deviation formula).
t9 t5
CLKOUT
MC_X_EBCCLKOUT
t6
t7
t8
Figure 21
CLKOUT Signal Timing
Note: The term CLKOUT refers to the reference clock output signal which is generated by selecting fSYS as the source signal for the clock output signal EXTCLK on pin P2.8 and by enabling the high-speed clock driver on this pin.
Data Sheet
94
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Variable Memory Cycles External bus cycles of the XC2365 are executed in five consecutive cycle phases (AB, C, D, E, F). The duration of each cycle phase is programmable (via the TCONCSx registers) to adapt the external bus cycles to the respective external module (memory, peripheral, etc.). The duration of the access phase can optionally be controlled by the external module using the READY handshake input. This table provides a summary of the phases and the ranges for their length. Table 28 Programmable Bus Cycle Phases (see timing diagrams) Parameter Valid Values Unit 1 ... 2 (5) TCS
Bus Cycle Phase
Address setup phase, the standard duration of this tpAB phase (1 ... 2 TCS) can be extended by 0 ... 3 TCS if the address window is changed Command delay phase Write Data setup/MUX Tristate phase Access phase Address/Write Data hold phase tpC tpD tpE tpF
0...3 0...1 1 ... 32 0...3
TCS TCS TCS TCS
Note: The bandwidth of a parameter (from minimum to maximum value) covers the whole operating range (temperature, voltage) as well as process variations. Within a given device, however, this bandwidth is smaller than the specified range. This is also due to interdependencies between certain parameters. Some of these interdependencies are described in additional notes (see standard timing). Timing values are listed in Table 29 and Table 30. The shaded parameters have been verified by characterization. They are not subject to production test.
Data Sheet
95
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 29 Parameter Output valid delay for: RD, WR(L/H) Output valid delay for: BHE, ALE Output valid delay for: A23 ... A16, A15 ... A0 (on P0/P1) Output valid delay for: A15 ... A0 (on P2/P10) Output valid delay for: CS External Bus Cycle Timing for Upper Voltage Range (Operating Conditions apply) Symbol Min. Limits Typ. Max. 13 13 14 14 13 14 14 ns ns ns ns ns ns ns - - - - - - - Unit Note
t10 CC t11 CC t12 CC t13 CC t14 CC
Output valid delay for: t15 CC D15 ... D0 (write data, MUX-mode) Output valid delay for: D15 ... D0 (write data, DEMUXmode) Output hold time for: RD, WR(L/H) Output hold time for: BHE, ALE
t16 CC t20 CC t21 CC
0 0 0 0 0 18 -4
8 8 8 8 8 - -
ns ns ns ns ns ns ns
Output hold time for: t23 CC A23 ... A16, A15 ... A0 (on P2/P10) Output hold time for: CS Output hold time for: D15 ... D0 (write data) Input setup time for: READY, D15 ... D0 (read data) Input hold time for: READY, D15 ... D0 (read data)1)
t24 CC t25 CC t30 SR t31 SR
1) Read data are latched with the same internal clock edge that triggers the address change and the rising edge of RD. Address changes before the end of RD have no impact on (demultiplexed) read cycles. Read data can change after the rising edge of RD.
Data Sheet
96
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 30 Parameter Output valid delay for: RD, WR(L/H) Output valid delay for: BHE, ALE Output valid delay for: A23 ... A16, A15 ... A0 (on P0/P1) Output valid delay for: A15 ... A0 (on P2/P10) Output valid delay for: CS External Bus Cycle Timing for Lower Voltage Range (Operating Conditions apply) Symbol Min. Limits Typ. Max. 20 20 22 22 20 21 21 ns ns ns ns ns ns ns - - - - - - - Unit Note
t10 CC t11 CC t12 CC t13 CC t14 CC
Output valid delay for: t15 CC D15 ... D0 (write data, MUX-mode) Output valid delay for: D15 ... D0 (write data, DEMUXmode) Output hold time for: RD, WR(L/H) Output hold time for: BHE, ALE
t16 CC t20 CC t21 CC
0 0 0 0 0 29 -6
10 10 10 10 10 - -
ns ns ns ns ns ns ns
Output hold time for: t23 CC A23 ... A16, A15 ... A0 (on P2/P10) Output hold time for: CS Output hold time for: D15 ... D0 (write data) Input setup time for: READY, D15 ... D0 (read data) Input hold time for: READY, D15 ... D0 (read data)1)
t24 CC t25 CC t30 SR t31 SR
1) Read data are latched with the same internal clock edge that triggers the address change and the rising edge of RD. Address changes before the end of RD have no impact on (demultiplexed) read cycles. Read data can change after the rising edge of RD.
Data Sheet
97
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
tpAB
CLKOUT
tpC
tpD
tpE
tpF
t21 t11
ALE
t11/t14
A23-A16, BHE, CSx High Address
t24
t10
RD WR(L/H)
t20
t31 t13 t23
Low Address
t30
Data In
AD15-AD0 (read) AD15-AD0 (write)
t13
Low Address
t15
Data Out
t25
MC_X_EBCMUX
Figure 22
Multiplexed Bus Cycle
Data Sheet
98
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
tpAB
CLKOUT
tpC
tpD
tpE
tpF
t21 t11
ALE
t11/t14
A23-A0, BHE, CSx Address
t24
t10
RD WR(L/H)
t20
t31 t30
D15-D0 (read) D15-D0 (write)
Data In
t16
Data Out
t25
MC_X_EBCDEMUX
Figure 23
Demultiplexed Bus Cycle
Data Sheet
99
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Bus Cycle Control with the READY Input The duration of an external bus cycle can be controlled by the external circuit using the READY input signal. The polarity of this input signal can be selected. Synchronous READY permits the shortest possible bus cycle but requires the input signal to be synchronous to the reference signal CLKOUT. An asynchronous READY signal puts no timing constraints on the input signal but incurs a minimum of one waitstate due to the additional synchronization stage. The minimum duration of an asynchronous READY signal for safe synchronization is one CLKOUT period plus the input setup time. An active READY signal can be deactivated in response to the trailing (rising) edge of the corresponding command (RD or WR). If the next bus cycle is controlled by READY, an active READY signal must be disabled before the first valid sample point in the next bus cycle. This sample point depends on the programmed phases of the next cycle.
Data Sheet
100
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
tpD
CLKOUT
tpE
tpRDY
tpF
t10
RD, WR
t20
t31 t30
D15-D0 (read) D15-D0 (write) Data In
t25
Data Out
t31 t30 t30
READY
t31
READY Synchronous
Not Rdy
t31 t30 t30
READY
t31
READY Asynchron.
Not Rdy
MC_X_EBCREADY
Figure 24
READY Timing
Note: If the READY input is sampled inactive at the indicated sampling point ("Not Rdy") a READY-controlled waitstate is inserted (tpRDY), sampling the READY input active at the indicated sampling point ("Ready") terminates the currently running bus cycle. Note the different sampling points for synchronous and asynchronous READY. This example uses one mandatory waitstate (see tpE) before the READY input value is used.
Data Sheet
101
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.6.5
Synchronous Serial Interface Timing
The following parameters are applicable for a USIC channel operated in SSC mode. Note: These parameters are not subject to production test but verified by design and/or characterization. Table 31 Parameter SSC Master/Slave Mode Timing for Upper Voltage Range (Operating Conditions apply), CL = 50 pF Symbol Min. Master Mode Timing Slave select output SELO active to first SCLKOUT transmit edge Values Typ. Max. Unit Note / Test Co ndition ns ns ns ns ns
2)
t1 CC
0 0.5 x
- - - - -
1)
Slave select output SELO inactive t2 CC after last SCLKOUT receive edge Transmit data output valid time Receive data input setup time to SCLKOUT receive edge Data input DX0 hold time from SCLKOUT receive edge Slave Mode Timing Select input DX2 setup to first clock input DX1 transmit edge Select input DX2 hold after last clock input DX1 receive edge Data input DX0 setup time to clock input DX1 receive edge Data input DX0 hold time from clock input DX1 receive edge Data output DOUT valid time
2) tSYS = 1/fSYS (= 12.5 ns @ 80 MHz)
3)
tBIT
-6 31 -7 13 - -
t3 CC t4 SR t5 SR
t10 SR t11 SR t12 SR t13 SR t14 CC
7 5 7 5 8
- - - - -
- - - - 29
ns ns ns ns ns
4)
4)
4)
4)
4)
1) The maximum value further depends on the settings for the slave select output leading delay. 3) The maximum value depends on the settings for the slave select output trailing delay and for the shift clock output delay. 4) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and receive data input (bits DXnCR.DSEN = 0).
Data Sheet
102
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters Table 32 Parameter SSC Master/Slave Mode Timing for Lower Voltage Range (Operating Conditions apply), CL = 50 pF Symbol Min. Master Mode Timing Slave select output SELO active to first SCLKOUT transmit edge Values Typ. Max. Unit Note / Test Co ndition ns ns ns ns ns
2)
t1 CC
0 0.5 x
- - - - -
1)
Slave select output SELO inactive t2 CC after last SCLKOUT receive edge Transmit data output valid time Receive data input setup time to SCLKOUT receive edge Data input DX0 hold time from SCLKOUT receive edge Slave Mode Timing Select input DX2 setup to first clock input DX1 transmit edge Select input DX2 hold after last clock input DX1 receive edge Data input DX0 setup time to clock input DX1 receive edge Data input DX0 hold time from clock input DX1 receive edge Data output DOUT valid time
2) tSYS = 1/fSYS (= 12.5 ns @ 80 MHz)
3)
2)
tBIT
-13 48 -11 16 - -
t3 CC t4 SR t5 SR
t10 SR t11 SR t12 SR t13 SR t14 CC
12 8 12 8 11
- - - - -
- - - - 44
ns ns ns ns ns
4)
4)
4)
4)
4)
1) The maximum value further depends on the settings for the slave select output leading delay. 3) The maximum value depends on the settings for the slave select output trailing delay and for the shift clock output delay. 4) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and receive data input (bits DXnCR.DSEN = 0).
Data Sheet
103
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
Master Mode Timing
t1
Select Output SELOx Clock Output SCLKOUT Data Output DOUT
Inactive Active
t2
Inactive
First Transmit Edge
Receive Edge
Transmit Edge
Last Receive Edge
t3 t4
Data Input DX0
t3 t4
t5
t5
Data valid
Data valid
Slave Mode Timing
t10
Select Input DX2 Clock Input DX1
Inactive Active
t11
Inactive
First Transmit Edge
Receive Edge
Transmit Edge
Last Receive Edge
t12
Data Input DX0
t13 t14
t12
t 13
Data valid
Data valid
t 14
Data Output DOUT
Transmit Edge: with this clock edge transmit data is shifted to transmit data output , . Receive Edge: with this clock edge receive data at receive data input is latched , . Drawn for BRGH.SCLKCFG = 00B. Also valid for for SCLKCFG = 01B with inverted SCLKOUT signal . USIC_SSC_TMGX.VSD
Figure 25
USIC - SSC Master/Slave Mode Timing
Note: This timing diagram shows a standard configuration where the slave select signal is low-active and the serial clock signal is not shifted and not inverted.
Data Sheet
104
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
4.6.6
JTAG Interface Timing
The following parameters are applicable for communication through the JTAG debug interface. The JTAG module is fully compliant with IEEE1149.1-2000. Note: These parameters are not subject to production test but verified by design and/or characterization. Table 33 Parameter TCK clock period TCK high time TCK low time TCK clock rise time TCK clock fall time TDI/TMS setup to TCK rising edge TDI/TMS hold after TCK rising edge TDO valid after TCK falling edge1) TDO high imped. to valid from TCK falling edge1)2) TDO valid to high imped. from TCK falling edge1) JTAG Interface Timing Parameters (Operating Conditions apply) Symbol Min. Values Typ. 50 - - - - - - - - - - Max. - - - 8 8 - - 30 - 30 30 60 16 16 - - 6 6 - 10 - - Unit Note / Test Condition ns ns ns ns ns ns ns ns ns ns ns - - - - - - - CL = 50 pF CL = 20 pF CL = 50 pF CL = 50 pF
t1 SR t2 SR t3 SR t4 SR t5 SR t6 SR t7 SR t8 CC t8 CC t9 CC t10 CC
1) The falling edge on TCK is used to generate the TDO timing. 2) The setup time for TDO is given implicitly by the TCK cycle time.
Data Sheet
105
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Electrical Parameters
t1
0.5 VDDP 0.9 VDDP
t2
t3
t5
t4
0.1 VDDP
MC_JTAG_TCK
Figure 26
Test Clock Timing (TCK)
TCK
t6
TMS
t7
t6
TDI
t7
t9
TDO
t8
t10
MC_JTAG
Figure 27
JTAG Timing
Data Sheet
106
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Package and Reliability
5
Package and Reliability
In addition to the electrical parameters, the following specifcations ensure proper integration of the XC2365 into the target system.
5.1
Packaging
These parameters specify the packaging rather than the silicon. Table 34 Parameter Exposed Pad Dimension Power Dissipation Thermal resistance Junction-Ambient Package Parameters (PG-LQFP-100-3) Symbol Min. Ex x Ey - Limit Values Max. 6.2 x 6.2 1.0 49 37 22 mm W - - Unit Notes
PDISS RJA
- -
K/W No thermal via1) K/W 4-layer, no pad2) K/W 4-layer, pad3)
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias; exposed pad not soldered. 2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not soldered. 3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered to the board.
Data Sheet
107
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Package and Reliability Package Outlines
Figure 28
PG-LQFP-100-3 (Plastic Green Thin Quad Flat Package)
All dimensions in mm. You can find complete information about Infineon packages, packing and marking in our Infineon Internet Page "Packages": http://www.infineon.com/packages
Data Sheet
108
V2.1, 2008-08
XC2365 XC2000 Family Derivatives
Package and Reliability
5.2
Thermal Considerations
When operating the XC2365 in a system, the total heat generated in the chip must be dissipated to the ambient environment to prevent overheating and the resulting thermal damage. The maximum heat that can be dissipated depends on the package and its integration into the target board. The "Thermal resistance RJA" quantifies these parameters. The power dissipation must be limited so that the average junction temperature does not exceed 150 C. The difference between junction temperature and ambient temperature is determined by T = (PINT + PIOSTAT + PIODYN) x RJA The internal power consumption is defined as PINT = VDDP x IDDP (see Section 4.2.3). The static external power consumption caused by the output drivers is defined as PIOSTAT = ((VDDP-VOH) x IOH) + (VOL x IOL) The dynamic external power consumption caused by the output drivers (PIODYN) depends on the capacitive load connected to the respective pins and their switching frequencies. If the total power dissipation for a given system configuration exceeds the defined limit, countermeasures must be taken to ensure proper system operation: * * * * Reduce VDDP, if possible in the system Reduce the system frequency Reduce the number of output pins Reduce the load on active output drivers
Data Sheet
109
V2.1, 2008-08
www.infineon.com
Published by Infineon Technologies AG

▲Up To Search▲

Price & Availability of XC236508

	To Download XC236508 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .